Skip to main content
SpringerLink
Log in

Twist wafer bonded “fixed-film” versus “compliant” substrates: correlated misfit dislocation generation and contaminant gettering

  • Published:
Applied Physics A Aims and scope Submit manuscript

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Author information

Authors and Affiliations

  1. Department of Mechanical Engineering and Materials Science, Duke University, Durham, NC 27708-0300, USA, , , , , , US

    T.Y. Tan

  2. Max-Planck-Institute of Microstructure Physics, Weinberg 2, D-06120 Halle, Germany, , , , , , DE

    U. Gösele

Authors
  1. T.Y. Tan
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. U. Gösele
    View author publications

    You can also search for this author in PubMed Google Scholar

Additional information

Received: 28 April 1997/Accepted: 29 April 1997

Rights and permissions

Reprints and permissions

About this article

Cite this article

Tan, T., Gösele, U. Twist wafer bonded “fixed-film” versus “compliant” substrates: correlated misfit dislocation generation and contaminant gettering . Appl Phys A 64, 631–633 (1997). https://doi.org/10.1007/s003390050530

Download citation

  • Issue Date:

  • DOI: https://doi.org/10.1007/s003390050530

Search

Navigation