New electrode-barrier structures for high density ferroelectric memories

Abstract.

In this paper, two electrode-barrier structures based on Pt-Rh and Pt-Ir alloys and their oxides are proposed for high-density ferroelectric memory applications. These electrode-barriers are multi-layered, comprising a diffusion barrier (PtRhOx or PtIrOx), metal alloy (PtRh or PtIr) and another PtRhOx or PtIrOx layer for fatigue reduction in the case of PZT capacitors. Both lead zirconate titanate (PZT) and strontium bismuth tantalate (SBT) capacitors based on the electrode-barriers were used in the present study. The electrode-barrier structure acts as a conducting electrode as well as an excellent diffusion barrier for lead, bismuth, oxygen and silicon. The PZT test capacitors fabricated on these electrode-barriers showed excellent fatigue resistance with other ferroelectric properties being similar to those on Pt. Also, these electrode-barriers are stable, and remain conductive even up to the processing temperatures of SBT (750 °C). This makes direct integration of both PZT and SBT capacitors on to a poly-Si plug attainable. In addition, the conducting electrode-barrier structures can be deposited in situ, directly over n+polycrystalline Si, thereby significantly improving the density of the device.