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The tensile and compressive deformation mechanisms of the Cu/Al2Cu/Al-layered composites via molecular dynamics simulation

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Abstract

To investigate the compression and deformation behavior of nano-polycrystalline Cu/Al2Cu/Al-layered composites, it was constructed and analyzed using molecular dynamics simulation (MD). The findings indicate that The Cu/Al2Cu/Al materials exhibit sensitivity to changes in the interfacial layer d due to the asymmetry between tensile and compressive deformations. The compressive strain strengthening of the nano-polycrystalline Cu/Al2Cu/Al-layered composites increases as the interfacial layer d increases. During the tensile process, an increase in interfacial layer d leads to an increase in Young's modulus, while the fracture strength and fracture strain first increase and then decrease. The interfacial layer with a value of d = 4.88 nm promotes the delocalization of strain during the tensile and compressive deformation of nano-polycrystalline Cu/Al2Cu/Al materials. It facilitates cooperative deformation behavior between components, leading to improved toughness and strength of the materials.

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Data and code availability

The data that support the findings of this study are available from the corresponding author (Aiqin Wang) upon reasonable request.

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Acknowledgements

We appreciate the financial support of the National Natural Science Foundation of China (Grant no. 52271131) and Key R&D and Promotion Project of Henan Province (no. 232102231006).

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Authors and Affiliations

  1. College of Materials Science and Engineering, Henan University of Science and Technology, Luoyang, 471023, People’s Republic of China

    Xiaoqian Bian, Aiqin Wang, Jingpei Xie, Pei Liu, Zhiping Mao & Zhenwei Liu

  2. Provincial and Ministerial Co-Construction of Collaborative Innovation Center for Non-Ferrous Metal New Materials and Advanced Processing Technology, Luoyang, 471023, People’s Republic of China

    Aiqin Wang, Jingpei Xie, Pei Liu & Zhiping Mao

Authors
  1. Xiaoqian Bian
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  2. Aiqin Wang
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  3. Jingpei Xie
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  4. Pei Liu
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  5. Zhiping Mao
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  6. Zhenwei Liu
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Contributions

XB performed the data analyses and wrote the manuscript; AW contributed to the conception of the study; JX helped perform the analysis with constructive discussions; PL contributed significantly to analysis and manuscript preparation; ZM and ZL contributed greatly to the collection and collation of data.

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Correspondence to Aiqin Wang.

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Bian, X., Wang, A., Xie, J. et al. The tensile and compressive deformation mechanisms of the Cu/Al2Cu/Al-layered composites via molecular dynamics simulation. Appl. Phys. A 129, 719 (2023). https://doi.org/10.1007/s00339-023-07002-4

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