Abstract
Microwave-metal discharge-based drilling of metallic materials involves use of thermal energy from the plasma column for material removal. However, poor control over plasma generated in atmospheric air causes wide heat-affected zone (HAZ) and poor surface integrity around the drilled hole. The present work is an attempt to minimize drilling-related defects by incorporating circulating liquid dielectric as the drilling media. Performance of microwave drilling was assessed after machining in liquid dielectric and atmospheric air media. Stainless steel (AISI 304) and pure tungsten were chosen as the work and tool materials, respectively. Process performance parameters, such as diametrical overcut, circularity, HAZ and material removal rate (MRR), were evaluated for the drilling intervals of 40, 50 and 60 s. It was observed that the dissipation of microwave power within the liquid dielectric medium reduces the intensity of the plasma column. In addition, pressure applied by the liquid dielectric medium over the plasma column aids in its confinement. As a result, a relatively less intense and more uniform plasma column is generated in the liquid dielectric medium, which reduces erosive action on the work material. This controlled removal of work material results in a significant reduction (up to 90%) in HAZ. The uniform nature of plasma column yielded better hole circularity in liquid dielectric medium.
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Abbreviations
- AISI:
-
American iron and steel institute
- DOC:
-
Diametrical overcut (%)
- EDS:
-
Energy dispersive X-ray spectroscopy
- FESEM:
-
Field emission scanning electron microscope
- HAZ:
-
Heat-affected zone (mm2)
- MRR:
-
Material removal rate (mg.s−1)
- MWD:
-
Microwave drilling
- \(A_{HAZ}\) :
-
Area of hole and HAZ (mm2)
- \(A_{h}\) :
-
Area of the drilled hole (mm2)
- \(C\) :
-
Circularity
- \(D_{max}\) :
-
Minimum circumscribing diameter at entry (mm)
- \(D_{min}\) :
-
Maximum inscribing diameter at entry (mm)
- \(D_{t}\) :
-
Tool diameter (mm)
- \(d_{pa}\) :
-
Plasma diameter in air medium (mm)
- \(d_{pl}\) :
-
Plasma diameter in liquid dielectric medium (mm)
- \(E\) :
-
Electric field intensity (V.m−1)
- \(E_{0}\) :
-
Electric field intensity at the surface (V.m−1)
- \(E_{max}\) :
-
Maximum value of electric field intensity (V.m−1)
- \(f\) :
-
Frequency (Hz)
- \(g\) :
-
Acceleration due to gravity
- \(H\) :
-
Magnetic field intensity (A.m−1)
- \(H_{t}\) :
-
Tangential component of magnetic field (A.m−1)
- \(h_{d}\) :
-
Height of liquid dielectric column (mm)
- \(J_{s}\) :
-
Surface current (A.m−1)
- \(k_{0}\) :
-
Wavenumber
- \(\Delta L\) :
-
Longitudinal tool wear (mm)
- \(p_{a}\) :
-
Pressure exerted by the atmospheric air (N.m−2)
- \(p_{atm}\) :
-
Atmospheric pressure (N.m−2)
- \(p_{d}\) :
-
Pressure exerted by the liquid dielectric (N.m−2)
- \(P_{l}\) :
-
Power dissipated by the dielectric medium (W.m−3)
- \(P_{s}\) :
-
Power dissipated due to the surface impedance (W.m−3)
- \(P_{t}\) :
-
Total power dissipated (W.m−3)
- \(R_{s}\) :
-
Surface resistivity (Ω)
- \(R^{2}\) :
-
Coefficient of determination
- \(t\) :
-
Drilling time (s)
- \(\beta\) :
-
Regression coefficient
- \(\gamma\) :
-
Regression error
- \(\delta_{s}\) :
-
Skin depth (µm)
- \(\varepsilon ^{\prime}\) :
-
Dielectric constant
- \(\varepsilon_{0}\) :
-
Permittivity of free space (F.m−1)
- \(\varepsilon_{r}\) :
-
Relative permittivity
- \(\varepsilon ^{\prime\prime}\) :
-
Dielectric loss factor (F.m−1)
- \(\eta_{0}\) :
-
Impedance of the free space (377Ω)
- \(\mu\) :
-
Mean
- \(\mu_{r}\) :
-
Relative permeability
- \(\mu ^{\prime\prime}\) :
-
Magnetic loss factor (H.m−1)
- \(\rho_{d}\) :
-
Density of liquid dielectric (kg.m−3)
- \(\sigma\) :
-
Standard deviation
- \(\sigma_{e}\) :
-
Electrical conductivity (S.m−1)
- \(\sigma_{i}\) :
-
Ionic conductivity (S.m−1)
- \(\omega\) :
-
Angular frequency (rad.s−1)
References
E. Jerby, V. Dikhtiar, U.S. Patent No. 6,114,676. Washington, DC: U.S. Patent and Trademark Office (2000)
E. Jerby, V. Dikhtyar, O. Aktushev, U. Grosglick, Science 298, 587 (2002)
Y. Meir, E. Jerby, IEEE Trans. Microw. Theory Tech. 60, 2665 (2012)
Y. Eshet, R.R. Mann, A. Anaton, T. Yacoby, A. Gefen, E. Jerby, IEEE Trans. Biomed. Eng. 53, 1174 (2006)
E. Jerby V. Dikhtyar (2006). Adv. Microw. Radio Freq. Process. Rep. Int. High Freq. Heat. 687: 694
T.J. George, A.K. Sharma, P. Kumar, I-Manager’s J. Mech. Eng. 2, 1 (2012)
A. Singh, A.K. Sharma, Appl. Phys. A Mater. Sci. Process. 126, 1 (2020)
A. Singh, A. K. Sharma, In Advances in Forming, Machining and Automation, eds. By M Shunmugam 2019 Kanthababu Springer Singapore 219
N.K. Lautre, A.K. Sharma, S. Das, P. Kumar, J. Therm. Sci. Eng. Appl. 7, 876 (2015)
G. Kumar, A.K. Sharma, J. Manuf. Process. 33, 184 (2018)
G. Kumar, R.R. Mishra, A.K. Sharma, J. Therm. Sci. Eng. Appl. 13, 1 (2021)
N. Natarajan, P. Suresh, Int. J. Adv. Manuf. Technol. 77, 1741 (2015)
I. Arrizubieta, A. Lamikiz, S. Martínez, E. Ukar, I. Tabernero, F. Girot, Int. J. Mach. Tools Manuf. 75, 55 (2013)
J. Sun, W. Wang, Q. Yue, C. Ma, J. Zhang, X. Zhao, Z. Song, Appl. Energy 175, 141 (2016)
M.P. Jahan, Y.S. Wong, Int. J. Adv. Manuf. Technol. 46, 1145 (2010)
A. Koutsospyros, W. Braida, C. Christodoulatos, D. Dermatas, N. Strigul, J. Hazard. Mater. 136, 1 (2006)
M.P. Jahan, Y.S. Wong, M. Rahman, J. Mater. Process. Technol. 209, 1706 (2009)
Y.A. Lebedev, Polymers (Basel). 13, 55 (2021)
J. Tao, A.J. Shih, J. Ni, J. Manuf. Sci. Eng. 130, 0110021 (2008)
P. Kiran, S. Mohanty, A.K. Das, Mater. Manuf. Process. 37, 640 (2022)
A.P. Arun, S.P.P. Hariharan, Mater. Manuf. Process. 22, 1 (2022)
D. Cai, Y. Tan, L. Zhang, J. Sun, Y. Zhang, L. Li, Q. Zhang, G. Zou, Z. Song, Y. Bai, J. Energy Inst. 100, 277 (2021)
P. Mishra, G. Sethi, A. Upadhyaya, Metall. Mater. Trans. Sci. 37, 839 (2006)
J. Sun, W. Wang, C. Zhao, Y. Zhang, C. Ma, Q. Yue, Ind. Eng. Chem. Res. 53, 2042 (2014)
R.R. Mishra, A.K. Sharma, Compos. Part A Appl. Sci. Manuf. 81, 78 (2016)
S. Tamang, S. Aravindan, Appl. Therm. Eng. 162, 114250 (2019)
C.Y. Cui, X.G. Cui, X.D. Ren, M.J. Qi, J.D. Hu, Y.M. Wang, Appl. Surf. Sci. 305, 817 (2014)
H.T. Lee, T.Y. Tai, J. Mater. Process. Technol. 142, 676 (2003)
J.C. Rebelo, A. Morao Dias, D. Kremer, J.L. Lebrun, J. Mater. Process. Technol. 84, 90 (1998)
N.K. Lautre, A.K. Sharma, P. Kumar, S. Das, J. Mater. Process. Technol. 225, 151 (2015)
P.J. Liew, J. Yan, T. Kuriyagawa, Appl. Surf. Sci. 276, 731 (2013)
M. Bhaumik, K. Maity, Part. Sci. Technol. 37, 977 (2019)
Acknowledgements
The authors acknowledge Science and Engineering Research Board (SERB), Department of Science and Technology (DST), Government of India for the financial assistance provided for the work, under the research grant no. CRG/2018/004305.
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Gupta, P., Singh, A., Sharma, A.K. et al. Influence of liquid dielectric medium on microwave-metal discharge-based drilling of AISI 304 stainless steel. Appl. Phys. A 129, 150 (2023). https://doi.org/10.1007/s00339-023-06441-3
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DOI: https://doi.org/10.1007/s00339-023-06441-3