Abstract
In this work, the interfacial modification of the ALD-SiO2/4H-SiC heterojunction with synergistic nitrogen–oxygen-atmosphere (N2/O2) rapid thermal annealing (RTA) and its physical mechanism have been systematically studied. Atomic layer deposition (ALD) can effectively suppress the carbon clusters generation at the SiO2/4H-SiC heterojunction interface and RTA in the synergistic N2/O2 can further reduce the interface states density, the near-interface-oxide-trap (NIOT) density and the leakage current. Oxygen can repair carbon-related defects, and nitrogen helps passivate carbon-related traps and dangling bonds. The synergistic N2/O2 RTA can enhance the interfacial passivation efficiency by converting sp3 carbon clusters into sp2 phases. These demonstrate that the proposed synergistic N2/O2 RTA associated with SiO2 deposition by ALD is a potential way to substitute the conventional toxic nitrous oxides annealing and high-budget thermal oxidation, which promotes the property and reliability of SiC devices.
Similar content being viewed by others
Data availability
The data that support this study are available from the corresponding author upon reasonable request.
References
P. Dong, P. Li, L. Zhang, H. Tan, Z. Hu, K. Zhou, Z. Li, X. Yu, J. Li, B. Huang, Phys. Rev. Appl. 15, 034007 (2021)
Q. Wang, X. Cheng, L. Zheng, P. Ye, M. Li, L. Shen, J. Li, D. Zhang, Z. Gu, Y. Yu, Appl. Surf. Sci. 410, 326 (2017)
T. Hosoi, D. Nagai, M. Sometani, Y. Katsu, H. Takeda, T. Shimura, M. Takei, H. Watanabe, Appl. Phys. Lett. 109, 182114 (2016)
T. Ono, C.J. Kirkham, S. Saito, Y. Oshima, Phys. Rev. B 96, 115311 (2017)
Y. Jia, H. Lv, Q. Song, X. Tang, L. Xiao, L. Wang, G. Tang, Y. Zhang, Y. Zhang, Appl. Surf. Sci. 397, 175 (2017)
C. Yang, F. Zhang, Z. Yin, Y. Su, F. Qin, D. Wang, Appl. Surf. Sci. 488, 293 (2019)
Y. Jia, H. Lv, X. Tang, C. Han, Q. Song, Y. Zhang, Y. Zhang, S. Dimitrijev, J. Han, D. Haasmann, J. Mater. Sci. Mater. Electron. 30, 10302 (2019)
H. Yoshioka, T. Nakamura, T. Kimoto, J. Appl. Phys. 115, 014502 (2014)
Y. Jia, H. Lv, X. Tang, Q. Song, Y. Zhang, Y. Zhang, S. Dimitrijev, J. Han, J. Mater. Sci. Mater. Electron. 29, 14292 (2018)
W. Lu, L. Feldman, Y. Song, S. Dhar, W. Collins, W. Mitchel, J. Williams, Appl. Phys. Lett. 85, 3495 (2004)
D. Dutta, D. De, D. Fan, S. Roy, G. Alfieri, M. Camarda, M. Amsler, J. Lehmann, H. Bartolf, S. Goedecker, Appl. Phys. Lett. 115, 101601 (2019)
A. Chanthaphan, T. Hosoi, S. Mitani, Y. Nakano, T. Nakamura, T. Shimura, H. Watanabe, Appl. Phys. Lett. 100, 252103 (2012)
A. Xiang, X. Xu, L. Zhang, Z. Li, J. Li, G. Dai, Appl. Phys. Lett. 112, 062101 (2018)
D. Okamoto, H. Yano, K. Hirata, T. Hatayama, T. Fuyuki, IEEE Electr. Device L. 31, 710 (2010)
D. Okamoto, M. Sometani, S. Harada, R. Kosugi, Y. Yonezawa, H. Yano, I.E.E.E. Electr, Device L. 35, 1176 (2014)
M. Cabello, V. Soler, G. Rius, J. Montserrat, J. Rebollo, P. Godignon, Mat. Sci. Semicon. Proc. 78, 22 (2018)
N. Yoshida, E. Waki, M. Arai, K. Yamasaki, J. Han, M. Takenaka, S. Takagi, Thin Sol. Films 557, 237 (2014)
P. Zhao, Y. Liu, C. Tin, W. Zhu, J. Ahn, Microelectron. Eng. 83, 61 (2006)
P. Fiorenza, L.K. Swanson, M. Vivona, F. Giannazzo, C. Bongiorno, S. Lorenti, A. Frazzetto, F. Roccaforte, Mater. Sci. Forum 778–780, 623 (2014)
S. Nakazawa, T. Okuda, J. Suda, T. Nakamura, T. Kimoto, IEEE T. Electron. Dev. 62, 309 (2015)
X. Yang, B. Lee, V. Misra, IEEE T. Electron. Dev. 63, 2826 (2016)
J. Wilt, Y. Gong, M. Gong, F. Su, H. Xu, R. Sakidja, A. Elliot, R. Lu, S. Zhao, S. Han, J.Z. Wu, Phys. Rev. Appl. 7, 064022 (2017)
G. Yazdi, T. Iakimov, R. Yakimova, Crystals 6, 53 (2016)
P. Borowicz, T. Gutt, T. Małachowski, M. Latek, Diam. Relat. Mater. 20, 665 (2011)
Z. Zhang, Z. Wang, Y. Guo, J. Robertson, Appl. Phys. Lett. 118, 031601 (2021)
C. Yang, Z. Yin, F. Zhang, Y. Su, F. Qin, D. Wang, Appl. Surf. Sci. 513, 145837 (2020)
X. Zhang, T. Matsumoto, U. Sakurai, T. Makino, M. Ogura, M. Sometani, S. Yamasaki, C.E. Nebel, T. Inokuma, N. Tokuda, Appl. Phys. Lett. 117, 092104 (2020)
S. Liu, S. Yang, Z. Tang, Q. Jiang, C. Liu, M. Wang, B. Shen, K.J. Chen, Appl. Phys. Lett. 106, 051605 (2015)
R.H. Kikuchi, K. Kita, Appl. Phys. Lett. 105, 032106 (2014)
M. Wang, M. Yang, W. Liu, J. Qi, S. Yang, C. Han, L. Geng, Y. Hao, IEEE T. Electron. Dev. 68, 1841 (2021)
Acknowledgements
This work was supported by the National Key Research and Development Program of China (Grant Nos. 2022YFB3604300, 2022YFB3604301), National Natural Science Foundation of China (Grant No. 11705263), Shanghai Rising-Star Program (21QA1410900), the Science and Technology Commission of Shanghai Municipality (Grant Nos. 20501110900 and 20501110800) and Shanghai Sailing Program (Grant No. 20YF1456700).
Author information
Authors and Affiliations
Corresponding authors
Ethics declarations
Conflict of interest
The authors state that they have no known competing financial interests or personal ties that could have influenced the research presented in this study.
Additional information
Publisher's Note
Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.
Rights and permissions
Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law.
About this article
Cite this article
Huang, F., Zheng, L., Cheng, X. et al. Interfacial modification mechanism of ALD-SiO2/4H-SiC heterojunction by synergistic nitrogen–oxygen-atmosphere RTA. Appl. Phys. A 128, 1132 (2022). https://doi.org/10.1007/s00339-022-06280-8
Received:
Accepted:
Published:
DOI: https://doi.org/10.1007/s00339-022-06280-8