Abstract
In this work, series of thin films of [Co(0.3 nm)/Ni(0.6 nm)]10/Cu(t nm)/[Co(0.3 nm)/Ni(0.6 nm)]10 (with t = 0, 2, 4, 6 nm) multilayers have been prepared on Si substrate to study the influence of Cu insertion layer on magnetic property. The as-prepared [Co(0.3 nm)/Ni(0.6 nm)]20 as well as films with Cu insertion layer exhibit perpendicular magnetic anisotropic (PMA) behavior. The values of coercivity are found to enhance with the increase in the thickness of the Cu insertion layer. The strength of PMA, critically depends on the thickness of the Cu insertion layer. The value of the effective PMA constant is found to decrease and it is estimated to be 9.5 × 105, 6.6 × 105, 2.2 × 105, 0.4 × 105 erg/cm3 for films with Cu insertion layers of 0, 2, 4, and 6 nm respectively. The observed PMA is explained in a correlation with surface topography and roughness studied by 3D optical profilometer images.
Similar content being viewed by others
References
N. Thiyagarajah, K. Lee, S. Bae, J. Appl. Phys. 111, 07C910 (2012)
F.J.A. den Broeder, E. Janssen, J. Aan de Stegge, J. Magn. Magn. Mater. 132, L5 (1994)
M. Heigl, R. Wendler, S.D. Haugg, M. Albrecht, J. Appl. Phys. 127, 233902 (2020)
E. Yang, V.M. Sokalski, M.T. Moneck, D.M. Bromberg, J.-G. Zhu, J. Appl. Phys. 113, 17C116 (2013)
M. Tang, Z. Zhang, Q. Jin, AIP Adv. 5, 087153 (2015)
Z. Li, Z. Zhang, H. Zhao, B. Ma, Q.Y. Jin, J. Appl. Phys. 106, 013907 (2009)
N.R. Lee-Hone, R. Thanhoffer, V. Neu, R. Schäfer, M. Arora, R. Hübner, D. Suess, D.M. Broun, E. Girt, J. Magn. Magn. Mater. 441, 283 (2017)
H. Ju, B. Li, G. Yu, Integr. Ferroelectr. 169, 153 (2016)
S.K. Srivastava, R. Hussain, T. Hauet, L. Piraux, AIP Conference Proceedings, vol. 2115 (2019), p. 030482
Y. Liu, J. Yu, H. Zhong, J. Magn. Magn. Mater. 381, 473 (2019)
A.G. Kolesnikov, H. Wu, M.E. Stebliy, A.V. Ognev, L.A. Chebotkevich, A.S. Samardak, X. Han, J. Magn. Magn. Mater. 449, 271 (2018)
H. He, Z. Zhang, B. Ma, Q. Jin, IEEE Trans. Magn. 46, 1327 (2010)
P. Matthes, M. Albrecht, Sens. Actuators A 233, 275 (2015)
G. Wu, S. Chen, Y. Ren, Q.Y. Jin, Z. Zhang, ACS Appl. Nano Mater. 2, 5140 (2019)
J. Yu, C. Yan, Y. Wang, W. Zhou, J. Xie, J. Gao, D. Zhou, Mater. Sci. Eng. B 87, 169 (2001)
B. Brahma, R. Hussain, R.K. Basumatary, Aakansha, S. Ravi, R. Brahma, S.K. Srivastava, J. Supercond. Nov. Magn. 33, 2891 (2020)
M. Arora, N.R. Lee-Hone, T. Mckinnon, C. Coutts, R. Hübner, B. Heinrich, E. Girt, J. Phys. D Appl. Phys. 50, 505003 (2017)
T. Hauet, L. Piraux, S.K. Srivastava, V.A. Antohe, D. Lacour, M. Hehn, F. Montaigne, J. Schwenk, M.A. Marioni, H.J. Hug, O. Hovorka, A. Berger, S. Mangin, F. Abreu Araujo, Phys. Rev. B 89, 174421 (2014)
L. Piraux, V. Antohe, F.A. Araujo, S.K. Srivastava, M. Hehn, D. Lacour, S. Mangin, T. Hauet, Appl. Phys. Lett. 101, 013110 (2012)
R.K. Basumatary, Aakansha, B. Basumatary, B. Brahma, R. Hussain, S. Ravi, R. Brahma, S.K. Srivastava, J. Supercond. Nov. Magn. 33, 3165 (2020)
R. Hussain, Aakansha, B. Brahma, R. Basumatary, R. Brahma, S. Ravi, S.K. Srivastava, J. Supercond. Nov. Magn. 33, 1759 (2020)
R. Hussain, Aakansha, B. Brahma, R.K. Basumatary, R. Brahma, S. Ravi, S.K. Srivastava, J. Supercond. Nov. Magn. 32, 4027 (2019)
R. Hussain, Aakansha, S. Ravi, S.K. Srivastava, J. Mater. Sci. Mater. Electron. 31, 11975 (2020)
R. Hussain, Aakansha, S. Ravi, S.K. Srivastava, Solid State Commun. 324, 114144 (2021)
J. Schwenk, H.J. Hug, M.A. Marioni, T. Hauet, M. Hehn, F. Abreu Araujo, V.A. Antohe, S.K. Srivastava, L. Piraux, IEEE International Magnetics Conference (INTERMAG), Beijing (2015), pp. 1–1. https://doi.org/10.1109/INTMAG.2015.7156676
B. Brahma, R. Hussain, Aakansha, P. Behra, S. Ravi, R. Brahma, S.K. Srivastava, Thin Solid Films 728, 138689 (2021)
Acknowledgements
SKS would like to acknowledge the financial support for a project through ‘Early Career Research Award’ from DST-SERB India, with sanction order number (ECR/2016/000713).
Author information
Authors and Affiliations
Corresponding author
Ethics declarations
Conflict of interest
The authors declare that they have no conflict of interest.
Data availability
The data that supports the findings of this study are available within the article.
Additional information
Publisher's Note
Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.
Rights and permissions
About this article
Cite this article
Brahma, B., Behera, P., Ravi, S. et al. Influence of Cu insertion layer on magnetic property of [Co(0.3 nm)/Ni(0.6 nm)]10/Cu/[Co(0.3 nm)/Ni(0.6 nm)]10 spin valve thin films. Appl. Phys. A 127, 680 (2021). https://doi.org/10.1007/s00339-021-04850-w
Received:
Accepted:
Published:
DOI: https://doi.org/10.1007/s00339-021-04850-w