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Effect of Sc and Y addition on the microstructure and properties of HCP-structured high-entropy alloys

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Abstract

This study aimed to design and prepare the following four kinds of refractory high-entropy alloys (RHEAs): TiZrHf, TiZrHfSc, TiZrHfY, and TiZrHfScY. All the four RHEAs showed a hexagonal close-packed (HCP)-based structure. Both the strength and ductility increased in the TiZrHfSc alloy compared with the TiZrHf alloy because of the addition of Sc element and the formation of a fine needle-like lamellar structure in the former. The mechanical properties of TiZrHfY and TiZrHfScY alloys decreased after the addition of Y element because of the segregation. The conductivity of TiZrHf, TiZrHfSc, TiZrHfY, and TiZrHfScY alloys decreased compared with that of pure Ti, Zr, Hf, Sc, and Y elements. However, their resistivity was comparable to the traditional electrical resistivity of the alloys at room temperature because of the serious lattice distortion in the HEAs. All the four alloys showed a typical paramagnetic behavior. These characteristics make the alloys suitable for industrial applications.

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Acknowledgements

This work was supported by the National Natural Science Foundation of China (Nos. 51671044, 51822402 and 51574058), Dalian Support Plan for Innovation of High-level Talents (Top and Leading Talents, 2015R013), the Fundamental Research Funds for the Central Universities (DUT16ZD206), Dalian Support Plan for Innovation of High-level Talents (Youth Technology Stars, 2016RQ005).

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Authors and Affiliations

  1. Key Laboratory of Solidification Control and Digital Preparation Technology (Liaoning Province), School of Materials Science and Engineering, Dalian University of Technology, 116024, Dalian, China

    Tiandang Huang, Yiping Lu, Tongmin Wang & Tingju Li

  2. College of mechanical and electronic engineering, Shandong University of Science and Technology, Qingdao, 266590, People’s Republic of China

    Hui Jiang

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Correspondence to Yiping Lu.

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Huang, T., Jiang, H., Lu, Y. et al. Effect of Sc and Y addition on the microstructure and properties of HCP-structured high-entropy alloys. Appl. Phys. A 125, 180 (2019). https://doi.org/10.1007/s00339-019-2484-1

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