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Structural and thermal performance of Ag, Ni, and Ag/Ni thin films as thermal interface material for light-emitting diode application

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Abstract

Silver (Ag), Nickel (Ni), and their stack (Ag/Ni) were prepared at various thicknesses on Al substrates by sputtering process and used as thermal interface material (TIM). The structural and thermal properties of prepared thin films were studied by XRD and transient method, respectively. XRD spectra confirmed the presence of cubic phase of both Ag and Ni. Phase changes from hexagonal to cubic were also noticed with Ni thin film in Ag/Ni stack. From transient analysis, low total thermal resistance (R th) and low rise in junction temperature (T j) of LED were observed with Ag (50 nm) thin film interface measured at >350 mA and recorded difference in T j (ΔT j) was high as 11.28 °C as compared with bare Al boundary condition. Overall, the performance of Ag thin film with low thickness was good on reducing R th and T j of device under test and can be used as thin film thermal interface material in electronic packaging.

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References

  1. Pekka Katila, UV and Industrial LED Applications Require Efficient Thermal Substrates (MAGAZINE). http://www.ledsmagazine.com/articles/print/volume-12/issue-3/features/thermal/uv-and-industrial-led-applications-require-efficient-thermal-substrates.html. Accessed 18 June 2014

  2. A. Largeanu, G.O. Pompilian, D.G. Galusca, M. Agop, S. Gurlui, UPB Sci. Bull. Ser. A 73,196 (2011)

    Google Scholar 

  3. S. Shanmugan, D. Mutharasu, I. Kamarulazizi, Opt. Quantum Electron. 46, 337 (2014)

    Article  Google Scholar 

  4. S. Shanmugan, D. Mutharasu, IEEE Trans. Device Mater. Reliab. 14, 30 (2014)

    Article  Google Scholar 

  5. S. Shanmugan, D. Mutharasu, J. Optoelectron. Biomed. Mater. 7, 1 (2015)

    Google Scholar 

  6. R. Mishra, R. Balasubramaniam, Corros. Sci. 46, 3019 (2004)

    Article  Google Scholar 

  7. S. Wang, J.K. Lewis, P.R. Roberge, U. Erb, Scripta Metall. Et Mater. 32, 735 (1994)

    Google Scholar 

  8. D. Resnik, J. Kovač, D. Vrtačnik, U. Aljančič, M. Možek, A. Zalar, S. Amon, Vacuum 82, 162 (2007)

    Article  ADS  Google Scholar 

  9. P.A Au, Ag plating in HBLED packaging solid state technology. http://cmclaboratories.com/documents. Accessed on 18 June 2016

  10. W.G Moffatt, The Handbook of Binary Phase Diagrams (Genium Pub., Schenectady, 1990) (in English)

  11. C. Duquenne, M.P. Besland, P.Y. Tessier, E. Gautron, Y. Scudeller, D. Averty, J. Phys. D 45, 015301 (2012)

    Article  ADS  Google Scholar 

  12. R. Prasher, Proc. IEEE 94, 1571 (2006)

    Article  Google Scholar 

  13. R.A. Sayer, J. Zeng, H.H. Hsu, D. Peroulis, T.S. Fisher, J. Microelectromech. Syst. 21, 850 (2012)

    Article  Google Scholar 

  14. M.J. Aus, B. Szpunar, U. Erb, A.M. El-Sherik, G. Palumbo, K.T. Aust, J. Appl. Phys. 75, 3632 (1994)

    Article  ADS  Google Scholar 

  15. Z. Li-Dan, S. Fang-Yuan, Z. Jie, T. Da-Wei, L. Yu-Hua, G. Chao-Hong, Chin. Phys. Lett. 29, 066301 (2012)

    Article  ADS  Google Scholar 

Download references

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Authors and Affiliations

  1. Nano Optoelectronic Research Laboratory, School of Physics, Universiti Sains Malaysia (USM), 11800, Minden, Pulau Pinang, Malaysia

    Subramani Shanmugan,  Aida Nur Jassriatul & Devarajan Mutharasu

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  1. Subramani Shanmugan
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  2. Aida Nur Jassriatul
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  3. Devarajan Mutharasu
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Correspondence to Subramani Shanmugan.

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Shanmugan, S., Jassriatul, .N. & Mutharasu, D. Structural and thermal performance of Ag, Ni, and Ag/Ni thin films as thermal interface material for light-emitting diode application. Appl. Phys. A 123, 273 (2017). https://doi.org/10.1007/s00339-017-0886-5

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  • DOI: https://doi.org/10.1007/s00339-017-0886-5

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