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Effect of cooling condition and Ag on the growth of intermetallic compounds in Sn-based solder joints

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Abstract

The intermetallic compound growth in Sn/Cu and Sn–3.5Ag/Cu solder joints undergoing cooling has been in-situ observed using synchrotron radiation X-ray imaging technique. The overall thickness of intermetallic compound attained during cooling condition is dependent on the rates of Cu precipitation or deposition from the bulk solder and Cu diffusion from grain boundary at interface. Although the net increase in IMC thickness contributed predominantly by deposition kinetics is greater for air cooling than in furnace cooling from the start temperature of \(300\,^\circ \hbox {C}\) for the first 20 min, the former solidifies before 30 min and the latter stays in liquid state for 1 h due to slower cooling rate and attains a bigger IMC of size about 14.5 \(\upmu \)m. In context of Sn–3.5Ag solders subjected to air cooling from 275 \(^\circ \)C, the presence of Ag contributes to the increment in overall IMC thickness during the cooling period. For the improvement in solder joints reliability, faster cooling rate and limiting the Ag content can be employed as the materials design and processing parameters.

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References

  1. K.H. Prakash, T. Sritharan, Interface reaction between copper and molten tin-lead solders. Acta Mater. 49(13), 2481–2489 (2001)

    Article  Google Scholar 

  2. H. Xiaowu, X. Tao, X. Jiang, Y. Li, Y. Liu, Z. Min, Effects of post-reflow cooling rate and thermal aging on growth behavior of interfacial intermetallic compound between SAC305 solder and Cu substrate. Appl. Phys. A 122(4), 278 (2016)

    Article  ADS  Google Scholar 

  3. T. Ventura, S. Terzi, M. Rappaz, A.K. Dahle, Effects of solidification kinetics on microstructure formation in binary Sn–Cu solder alloys. Acta Mater. 59(4), 1651–1658 (2011)

    Article  Google Scholar 

  4. H.-Y. Hsiao, C.-M. Liu, H. Lin, T.-C. Liu, L. Chia-Ling, Y.-S. Huang, K.N.T. Chih Chen, Unidirectional growth of microbumps on (111)-oriented and nanotwinned copper. Science 336(6084), 1007–1010 (2012)

    Article  ADS  Google Scholar 

  5. A. Kunwar, H. Ma, H. Ma, J. Sun, N. Zhao, M. Huang, On the increase of intermetallic compounds thickness at the cold side in liquid Sn and SnAg solders under thermal gradient. Mater. Lett. 172, 211–215 (2016)

    Article  Google Scholar 

  6. Y.C. Chan, S.H. Fan, J.K.L. Lai, The effect of cooling rate on the growth of Cu–Sn intermetallics in annealed PBGA solder joints. J. Electron. Packag. 125(1), 153 (2003)

    Article  Google Scholar 

  7. H.T. Ma, L. Qu, M.L. Huang, L.Y. Gu, N. Zhao, L. Wang, In-situ study on growth behavior of \(\text{ Ag }_3\text{ Sn }\) in Sn3.5Ag/Cu soldering reaction by synchrotron radiation real-time imaging technology. J. Alloys Compd. 537, 286–290 (2012)

    Article  Google Scholar 

  8. L. Qu, H.T. Ma, H.J. Zhao, A. Kunwar, N. Zhao, In situ study on growth behavior of interfacial bubbles and its effect on interfacial reaction during a soldering process. Appl. Surf. Sci. 305, 133–138 (2014)

    Article  ADS  Google Scholar 

  9. M.L. Huang, F. Yang, N. Zhao, Y.C. Yang, Synchrotron radiation real-time in situ study on dissolution and precipitation of \(\text{ Ag }_3\text{ Sn }\) plates in sub-50 \(\upmu \)m Sn–Ag–Cu solder bumps. J. Alloys Compd. 602, 281–284 (2014)

    Article  Google Scholar 

  10. M.A.A. Mohd Salleh, S.D. McDonald, C.M. Gourlay, S.A. Belyakov,H. Yasuda, K. Nogita, Effect of Ni on the formation and growthof primary Cu6Sn5 intermetallics in Sn–0.7 wt.% Cu solder pasteson cu substrates during the soldering process. J.Electron. Mater. 45(1), 154–163 (2015)

  11. M.A.A. Mohd Salleh, S.D. McDonald, H. Yasuda, A. Sugiyama, K. Nogita, Rapid \(\text{ Cu }_6\text{ Sn }_5\) growth at liquid Sn/solid Cu interfaces. Scripta Mater. 100, 17–20 (2015).

  12. A. Kunwar, H. Ma, J. Sun, S. Li, J. Liu, Modeling the diffusion-driven growth of a pre-existing gas bubble in molten tin. Met. Mater. Int. 21(5), 962–970 (2015)

    Article  Google Scholar 

  13. M.A.A. Mohd Salleh, S.D. McDonald, C.M. Gourlay, H. Yasuda, K. Nogita, Suppression of \(\text{ Cu }_6\text{ Sn }_5\) in \(\text{ TiO }_2\) reinforced solder joints after multiple reflow cycles. Mater. Des. 108, 418–428 (2016)

    Google Scholar 

  14. H. Xie, B. Deng, G. Du, Y. Fu, Y. He, H. Guo, G. Peng, Y. Xue, G. Zhou, Y. Ren, Y. Wang, R. Chen, Y. Tong, T. Xiao, X-ray biomedical imaging beamline at SSRF. J. Instrum. 8(08), C08003 (2013)

    Article  Google Scholar 

  15. N. Cheung, N.S. Santos, J.M.V. Quaresma, G.S. Dulikravich, A. Garcia, Interfacial heat transfer coefficients and solidification of an aluminum alloy in a rotary continuous caster. Int. J. Heat Mass Transf. 52(1–2), 451–459 (2009)

    Article  MATH  Google Scholar 

  16. T. Gancarz, W. Gasior, H. Henein, Physicochemical properties of Sb, Sn, Zn, and Sb–Sn system. Int. J. Thermophys. 34(2), 250–266 (2013)

    Article  ADS  Google Scholar 

  17. T. Gancarz, Z. Moser, W. Gasior, J. Pstruś, H. Henein, A comparison of surface tension, viscosity, and density of Sn and SnAg alloys using different measurement techniques. Int. J. Thermophys. 32, 1210–1233 (2011)

    Article  ADS  Google Scholar 

  18. F. Meydaneri, M. Gündüz, M. Özdemir, B. Saatçi, Determination of thermal conductivities of solid and liquid phases for rich-Sn compositions of Sn–Mg alloy. Met. Mater. Int. 18(1), 77–85 (2012)

    Article  Google Scholar 

  19. D. Gaston, C. Newman, G. Hansen, D. Lebrun-Grandié, MOOSE: a parallel computational framework for coupled systems of nonlinear equations. Nucl. Eng. Des. 239(10), 1768–1778 (2009)

    Article  Google Scholar 

  20. M.R. Tonks, D. Gaston, P.C. Millett, D. Andrs, P. Talbot, An object-oriented finite element framework for multiphysics phase field simulations. Comput. Mater. Sci. 51(1), 20–29 (2012)

    Article  Google Scholar 

  21. A. Kunwar, H. Ma, H. Ma, B. Guo, Z. Meng, N. Zhao, M. Huang, On the thickness of \(\text{ Cu }_6\text{ Sn }_5\) compound at the anode of Cu/liquid Sn/Cu joints undergoing electromigration. J. Mater. Sci.: Mater. Electron. 27, 7699–7706 (2016)

    Google Scholar 

  22. A. Kunwar, H. Ma, M. Qi, J. Sun, L. Qu, B. Guo, N. Zhao, Y. Wang, H. Ma. Positive feedback on imposed thermal gradient by interfacial bubbles in Cu/liquid Sn–3.5Ag/Cu joints, in 17th International Conference on Electronic Packaging Technology (IEEE, Wuhan, 2016), pp. 608–611

  23. J.F. Li, P.A. Agyakwa, C.M. Johnson, Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process. Acta Mater. 59(3), 1198–1211 (2011)

    Article  Google Scholar 

  24. M. Yang, Y. Cao, S. Joo, H. Chen, X. Ma, M. Li, \(\text{ Cu }_6\text{ Sn }_5\) precipitation during Sn-based solder/Cu joint solidification and its effects on the growth of interfacial intermetallic compounds. J. Alloys Compd. 582, 688–695 (2014)

    Article  Google Scholar 

  25. H.-T. Ma, J. Wang, L. Qu, N. Zhao, A. Kunwar, A study on the physical properties and interfacial reactions with Cu substrate of rapidly solidified Sn–3.5Ag lead-free solder. J. Electron. Mater. 42(8), 2686–2695 (2013)

    Article  ADS  Google Scholar 

  26. A. Kisasoz, S. Gurel, A. Karaaslan, Effects of annealing time and cooling rate on precipitations in duplex stainless steel. Met. Sci. Heat Treat. 57(1), 8–11 (2016)

    Google Scholar 

  27. M. Schaefer, R.A. Fournelle, J. Liang, Theory for intermetallic phase growth between cu and liquid Sn–Pb solder based on grain boundary diffusion control. J. Electron. Mater. 27(11), 1167–1176 (1998)

    Article  ADS  Google Scholar 

  28. K.N. Tu, A.M. Gusak, I. Sobchenko, Linear rate of grain growth in thin films during deposition. Phys. Rev. B 67, 245408(1–5) (2003)

    ADS  Google Scholar 

  29. X. Liu, M. Huang, Y. Zhao, C.M.L. Wu, L. Wang, The adsorption of Ag\(_3\)Sn nano-particles on Cu–Sn intermetallic compounds of Sn–3Ag–0.5Cu/Cu during soldering. J. Alloys Compd. 492(1–2), 433–438 (2010)

    Article  Google Scholar 

  30. D.Q. Yu, L. Wang, C.M.L. Wu, C.M.T. Law, The formation of nano-Ag\(_3\)Sn particles on the intermetallic compounds during wetting reaction. J. Alloys Compd. 389(1–2), 153–158 (2005)

    Article  Google Scholar 

  31. X.C. Xie, X.C. Zhao, Y. Liu, J.W. Cheng, B. Zheng, Y. Gu, Effect of Ag addition on growth of the interfacial intermetallic compounds between Sn–0.7Cu solder and Cu substrate. Mater. Sci. Forum 815, 129–134 (2015)

    Article  Google Scholar 

  32. M.L. Huang, F. Yang, N. Zhao, Thermomigration-induced asymmetrical precipitation of Ag\(_3\)Sn plates in micro-scale Cu/Sn3.5Ag/Cu interconnects. Mater. Des. 89, 116–120 (2016)

    Google Scholar 

  33. H.T. Lee, Y.F. Chen, Evolution of Ag\(_3\)Sn intermetallic compounds during solidification of eutectic Sn–3.5Ag solder. J. Alloys Compd. 509(5), 2510–2517 (2011)

    Article  MathSciNet  Google Scholar 

  34. L. Sun, L. Zhang, X. Le, S.-J. Zhong, J. Ma, L. Bao, Effect of nano-Al addition on properties and microstructure of low-Ag content Sn1Ag0.5Cu solders. J. Mater. Sci.: Mater. Electron. 27(7), 7665–7673 (2016)

    Google Scholar 

Download references

Acknowledgements

This work was supported by the National Natural Science Foundation of China (Grant Nos.: 51571049 and 51301030). The synchrotron radiation experiments were performed at the BL13W1 beam line of Shanghai Synchrotron Radiation Facility (SSRF), China.

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Authors and Affiliations

  1. School of Materials Science and Engineering, Dalian University of Technology, Dalian, 116024, China

    Haoran Ma, Bingfeng Guo, Junhao Sun, Chengrong Jiang, Yunpeng Wang, Ning Zhao & Haitao Ma

  2. School of Mechanical Engineering, Dalian University of Technology, Dalian, 116024, China

    Anil Kunwar & Xueguan Song

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  1. Haoran Ma
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  2. Anil Kunwar
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Correspondence to Haitao Ma.

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Ma, H., Kunwar, A., Guo, B. et al. Effect of cooling condition and Ag on the growth of intermetallic compounds in Sn-based solder joints. Appl. Phys. A 122, 1052 (2016). https://doi.org/10.1007/s00339-016-0543-4

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