Skip to main content

Advertisement

SpringerLink
Log in

Void shrinking process and mechanisms of the diffusion bonded Ti–6Al–4V alloy with different surface roughness

  • Published:
Applied Physics A Aims and scope Submit manuscript

Abstract

The diffusion bonding of Ti–6Al–4V alloy with different surface roughness was performed at 5 and 10 MPa. The influence of surface roughness on the void shrinking process and mechanisms was investigated. The average void size increases as the R a increases from 0.33 to 0.44 μm, while it decreases as the R a increases to 0.46 μm because of the decreasing of R λq. The void shrinking mechanisms were analyzed by using the dynamic model of void shrinking. Power-law creep is a dominant mechanism on void shrinking, of which the contribution decreases as the R a increases from 0.33 to 0.44 μm, while it increases as the R a increases to 0.46 μm. The influence of surface roughness on the contribution of plastic deformation and surface source mechanism on void shrinking is not significant while that on the contribution of interface source mechanism is dependent on the imposing pressure. The optimizing surface roughness is with a R a of 0.33 μm and R λq of 5.38 μm in this study.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9

Similar content being viewed by others

References

  1. L.D. Hefti, J. Miner. Metals Mater. Soc. 62, 42 (2010)

    Article  Google Scholar 

  2. Y.W. Xun, M.J. Tan, J. Mater. Process Technol. 99, 80–85 (2000)

    Article  Google Scholar 

  3. A. Bahramian, Appl. Surf. Sci. 311, 508 (2014)

    Article  ADS  Google Scholar 

  4. M.F. Islam, J. Pilling, N. Ridley, Mater. Sci. Technol. 13, 1045 (1997)

    Article  Google Scholar 

  5. H. Somekawa, K. Higashi, Mater. Trans. 44, 1640 (2003)

    Article  Google Scholar 

  6. G.G. Zhang, R.S. Chandel, J. Mater. Sci. 40, 1793 (2005)

    Article  ADS  Google Scholar 

  7. A.R. Wang, O. Ohashi, K. Ueno, Mater. Trans. 47, 179 (2006)

    Article  Google Scholar 

  8. X. Shao, X.L. Guo, Y.F. Han, W.J. Lu, J.N. Qin, D. Zhang, Mater. Des. 65, 1001 (2014)

    Article  Google Scholar 

  9. A.S. Zuruzi, H. Li, G. Dong, Mater. Sci. Eng. A 270, 244 (1999)

    Article  Google Scholar 

  10. B. Derby, E.R. Wallach, Metal Sci. 18, 427 (1984)

    Article  Google Scholar 

  11. A. Hill, E.R. Wallach, Acta Metall. 37, 2425 (1989)

    Article  Google Scholar 

  12. H. Chen, Y. Zhong, W. Hu, G. Gottstein, Mater. Sci. Eng. A 452–453, 625 (2007)

    Article  Google Scholar 

  13. H.Y. Chen, J. Cao, J.K. Liu, X.G. Song, J.C. Feng, Comput. Mater. Sci. 71, 179 (2013)

    Article  Google Scholar 

  14. R.F. Ma, M.Q. Li, H. Li, W.X. Yu, Sci. China Technol. Sci. 55, 2420 (2012)

    Article  Google Scholar 

Download references

Acknowledgments

The authors gratefully appreciate the financial support from the National Natural Science Foundation of China (51505386 and 51275416), the China Postdoctoral Science Foundation (2014M562447) and the Research Fund of the State Key Laboratory of Solidification Processing (NWPU), China (BP201503).

Author information

Authors and Affiliations

  1. State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an, 710072, People’s Republic of China

    H. Li, M. Q. Li & P. J. Kang

  2. School of Materials Science and Engineering, Northwestern Polytechnical University, Xi’an, 710072, People’s Republic of China

    H. Li & M. Q. Li

Authors
  1. H. Li
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. M. Q. Li
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. P. J. Kang
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to H. Li.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Li, H., Li, M.Q. & Kang, P.J. Void shrinking process and mechanisms of the diffusion bonded Ti–6Al–4V alloy with different surface roughness. Appl. Phys. A 122, 18 (2016). https://doi.org/10.1007/s00339-015-9546-9

Download citation

  • Received:

  • Accepted:

  • Published:

  • DOI: https://doi.org/10.1007/s00339-015-9546-9

Keywords

Search

Navigation