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Tuning the thermal conductivity of multi-layer graphene with interlayer bonding and tensile strain

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Abstract

We investigate the thermal conductivity of interlayer-bonded bilayer graphene, trilayer graphene, and pyrolytic graphite using molecular dynamics simulations. We find that interlayer sp 3 bonding greatly reduces the thermal conductivity, with the reduction up to 80 %, depending on the distribution and coverage of sp 3 bonds. Besides, we find that tensile strain reduces the thermal conductivity of interlayer-bonded graphene further by up to 50 %. Our findings suggest the possibility of using interlayer sp 3 bonds and tensile strain to tune and manipulate the thermal conductivity of multi-layer graphene, which may be useful in thermal management of graphene-based nanodevices and in thermoelectric applications of graphene.

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Acknowledgments

This work is supported by the Agency for Science, Technology and Research (A*STAR), Singapore.

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Authors and Affiliations

  1. Institute of High Performance Computing, A*STAR, 1 Fusionopolis Way, #16-16 Connexis, Singapore, 138632, Singapore

    Taiyu Guo, Xiangjun Liu, Gang Zhang, Tianfu Guo, Qing-Xiang Pei & Yong-Wei Zhang

  2. Department of Mathematics, University of California, Los Angeles, CA, 90095, USA

    Taiyu Guo

  3. International Center for Applied Mechanics, State Key Laboratory for Strength and Vibration of Mechanical Structures, Xi’an Jiaotong University, Xi’an, 710049, China

    Zhen-Dong Sha

Authors
  1. Taiyu Guo
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  2. Zhen-Dong Sha
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  3. Xiangjun Liu
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  4. Gang Zhang
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  5. Tianfu Guo
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  6. Qing-Xiang Pei
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  7. Yong-Wei Zhang
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Correspondence to Qing-Xiang Pei or Yong-Wei Zhang.

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Guo, T., Sha, ZD., Liu, X. et al. Tuning the thermal conductivity of multi-layer graphene with interlayer bonding and tensile strain. Appl. Phys. A 120, 1275–1281 (2015). https://doi.org/10.1007/s00339-015-9373-z

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  • DOI: https://doi.org/10.1007/s00339-015-9373-z

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