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A simulation approach to material removal in microwave drilling of soda lime glass at 2.45 GHz

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Abstract

Material removal during microwave drilling is basically due to thermal ablation of the material in the vicinity of the drilling tool. The microtip of the tool, also termed as concentrator, absorbs microwaves and ionizes the dielectric in its proximity creating a zone of plasma. The plasma takes the shape of a sphere owing to the atmospheric sphere, which acts as the source of thermal energy to be used for processing a material. This mechanism of heating, also called localized microwave heating, was used in the present study to drill holes in 1.2-mm-thick soda lime glass. The mechanism of material removal had been analyzed through simulation of the hot spot region, and the results were attempted to explain through experiment observations. It was realized that the glass being a poor conductor of heat, a low power (90 W in this case) yields better drilling results owing to more localized heat corresponding to a low-volume plasma sphere. The low application time prevents further heat transfer, and a localized concentration of heat becomes possible that primarily causes the material ablation. The plasma sphere appears sustain while the tool moves through the bulk of the glass thickness although its volume gets further shrunk. The process needs careful selection of the parameters. The simulation results show relatively low temperature in the top half (opposite to the tool tip) of the plasma sphere which eventually causes the semimolten viscous glass to collapse into the drill cavity as the tool advances into the bulk and stops the movement of the tool. The continued plasma sphere raises the tip temperature, which makes the tip to melt and gets blunt. The plasma formation ceases owing to larger diameter of the tool, and the tool gets stuck which could be verified through experimental results.

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Abbreviations

B :

Magnetic induction or magnetic flux density (T)

C :

Function of material property

C p :

Specific heat capacity (J/kg K)

D :

Electric intensity (A s/m2)

∇:

Vector of partial derivatives

E :

Electric field intensity (V/m)

\( \varepsilon^{'} \) :

Dielectric loss factor

\( \varepsilon_{r} \) :

Relative permittivity

ɛ 0 :

Permittivity of free space (F/m)

F v :

Body force/ volume (N/mm3)

f :

Frequency (Hz)

H :

Magnetic field intensity (A/m)

j :

Imaginary or reflective unit

J :

Current flux (A/m2)

k :

Thermal conductivity (W/m K)

λ :

Microwave wavelength (mm)

μ r :

Relative permeability

μ 0 :

Permeability of free space (H/m)

ω :

Angular frequency (rad/s)

Q :

Heating source (W/m3)

r :

Resistivity of material (Ω m)

ρ :

Density (kg/m3)

σ :

Conductivity (S/m)

T :

Temperature (K)

t :

Time (s)

u :

Displacement (mm)

EDS:

Energy dispersive spectroscopy

EM:

Electromagnetic

EMI:

Electromagnetic interference

FEA:

Finite element analysis

FDTD:

Finite difference time domain

FESEM:

Field emission scanning electron microscope

HAZ:

Heat affected zone

HOC:

Hole overcut

LMH:

Localized microwave heating

PDE:

Partial differential equation

S:

Skin depth

Su:

Magnetic susceptibility

TBC:

Thermal barrier coating

TE:

Transverse electric

V:

Volume

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Acknowledgments

Acknowledgments are due to Board of Research in Nuclear Science (BRNS), India, for financial assistance received through DAE project no. 2010/36/60-BRNS/2048 titled “Material joining and drilling with microwave.”

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Authors and Affiliations

  1. Department of Mechanical and Industrial Engineering, Indian Institute of Technology Roorkee, Roorkee, 247 667, Uttarakhand, India

    Nitin Kumar Lautre, Apurbba Kumar Sharma & Kumar Pradeep

  2. Reactor Control Division, Bhabha Atomic Research Center Mumbai, Mumbai, 400 085, Maharastra, India

    Shantanu Das

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  1. Nitin Kumar Lautre
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  2. Apurbba Kumar Sharma
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  3. Kumar Pradeep
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  4. Shantanu Das
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Correspondence to Nitin Kumar Lautre.

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Lautre, N.K., Sharma, A.K., Pradeep, K. et al. A simulation approach to material removal in microwave drilling of soda lime glass at 2.45 GHz. Appl. Phys. A 120, 1261–1274 (2015). https://doi.org/10.1007/s00339-015-9370-2

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