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Experimental investigation on wetting process of water droplets on micro-/nanoporous copper films

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Abstract

In this paper, the dynamics of contact angle and droplet spreading were combined to study wetting process of droplet on porous media, revealing comprehensive information about surface spreading and internal spreading of the droplet. To precisely locate the precursor rim in the droplet spreading test, background subtraction method was proposed for use in visualizing the precursor rim. Two types of micro-/nanoporous copper films fabricated by an electrochemical deposition method were tested. The results indicated that contact angle of the micro-/nanoporous copper films decreased with time quickly and became 0° at last, which is a result of surface spreading combined with down-absorption. The dynamic of precursor rim velocity which can reflect the kinetics of internal spreading was divided into three stages: friction dominant stage, balance stage and exhausting stage. In the friction dominant stage, the velocity of precursor rim can be described by an exponential law, while the velocity of precursor rim in balance stage, which is only affected by the internal characteristics of porous media, was proposed to compare internal wettability of porous media.

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Acknowledgments

The present research was supported by the National Natural Science Foundation of China (Nos. 51275098, 51405165 and 51375175) and the Fundamental Research Funds for the Central universities, SCUT (2013ZZ017).

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Authors and Affiliations

  1. Key Laboratory of Surface Functional Structure Manufacturing of the Guangdong Higher Education Institutes, South China University of Technology, Guangzhou, 510640, China

    Limei Miao, Longsheng Lu, Ting Fu & Yong Tang

  2. Institute of Electronic Paper Displays, South China Academy of Advanced Optoelectronics, South China Normal University, Guangzhou, 510006, China

    Biao Tang

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  1. Limei Miao
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  2. Longsheng Lu
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  3. Ting Fu
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  4. Yong Tang
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  5. Biao Tang
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Correspondence to Longsheng Lu.

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Miao, L., Lu, L., Fu, T. et al. Experimental investigation on wetting process of water droplets on micro-/nanoporous copper films. Appl. Phys. A 120, 255–263 (2015). https://doi.org/10.1007/s00339-015-9162-8

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  • DOI: https://doi.org/10.1007/s00339-015-9162-8

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