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High aspect ratio microstructuring of transparent dielectrics using femtosecond laser pulses: method for optimization of the machining throughput

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Abstract

High average power, high repetition rate femtosecond lasers with μJ pulse energies are increasingly used for material processing applications. The unique advantage of material processing with sub-picosecond lasers is efficient, fast and localized energy deposition, which leads to high ablation efficiency and accuracy in nearly all kinds of solid materials. This work focuses on the machining of high aspect ratio structures in transparent dielectrics, in particular chemically strengthened Xensation™ glass from Schott using multi-pass ablative material removal. For machining of high aspect ratio structures, among others needed for cutting applications, a novel method to determine the best relation between kerf width and number of overscans is presented. The importance of this relation for optimization of the machining throughput will be demonstrated.

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Acknowledgments

The authors would like to thank Schott AG for providing the chemically strengthened glass sample.

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Authors and Affiliations

  1. Spectra Physics, Feldgut 9, 6830, Rankweil, Austria

    F. Hendricks, J. Aus der Au & V. V. Matylitsky

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  1. F. Hendricks
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  2. J. Aus der Au
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  3. V. V. Matylitsky
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Correspondence to F. Hendricks or V. V. Matylitsky.

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Hendricks, F., der Au, J.A. & Matylitsky, V.V. High aspect ratio microstructuring of transparent dielectrics using femtosecond laser pulses: method for optimization of the machining throughput. Appl. Phys. A 117, 149–153 (2014). https://doi.org/10.1007/s00339-014-8312-8

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  • DOI: https://doi.org/10.1007/s00339-014-8312-8

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