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Characterization of nanostructured CuO–porous silicon matrix formed on copper-coated silicon substrate via electrochemical etching

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Abstract

A pulsed anodic etching method has been utilized for nanostructuring of a copper-coated p-type (100) silicon substrate, using HF-based solution as electrolyte. Scanning electron microscopy reveals the formation of a nanostructured matrix that consists of island-like textures with nanosize grains grown onto fiber-like columnar structures separated with etch pits of grooved porous structures. Spatial micro-Raman scattering analysis indicates that the island-like texture is composed of single-phase cupric oxide (CuO) nanocrystals, while the grooved porous structure is barely related to formation of porous silicon (PS). X-ray diffraction shows that both the grown CuO nanostructures and the etched silicon layer have the same preferred (220) orientation. Chemical composition obtained by means of X-ray photoelectron spectroscopic (XPS) analysis confirms the presence of the single-phase CuO on the surface of the patterned CuO–PS matrix. As compared to PS formed on the bare silicon substrate, the room-temperature photoluminescence (PL) from the CuO–PS matrix exhibits an additional weak ‘blue’ PL band as well as a blue shift in the PL band of PS (S-band). This has been revealed from XPS analysis to be associated with the enhancement in the SiO2 content as well as formation of the carbonyl group on the surface in the case of the CuO–PS matrix.

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Acknowledgement

The authors would like to thank the Director General of AECS, Prof. I. Othman, for encouragement and support.

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Authors and Affiliations

  1. Department of Physics, Atomic Energy Commission of Syria, P.O. Box 6091, Damascus, Syria

    M. Naddaf

  2. Department of Chemistry, Atomic Energy Commission of Syria, P.O. Box 6091, Damascus, Syria

    O. Mrad & A. Al-zier

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  1. M. Naddaf
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Naddaf, M., Mrad, O. & Al-zier, A. Characterization of nanostructured CuO–porous silicon matrix formed on copper-coated silicon substrate via electrochemical etching. Appl. Phys. A 115, 1345–1353 (2014). https://doi.org/10.1007/s00339-013-8008-5

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