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On the thermal expansion of CNT/Cu composites for electronic packaging applications

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Abstract

Carbon nanotubes (CNTs) exhibit both excellent high thermal conductivity and low coefficient of thermal expansion (CTE), which are an ideal reinforcement in composite materials for high performance electronic packaging applications. In the present study, CNT/Cu composites containing CNTs varying from 0 vol.% to 15 vol.% are prepared, and their CTE behavior is studied in detail. The results indicate that the CTE of 0–10 vol.% CNT/Cu composites is significantly decreased with increasing CNT content. However, as the CNT content increases to 15 vol.%, the decrease in CTE of the composites is pronouncedly reduced. Possible mechanisms are discussed in combination with CTE model predictions.

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Acknowledgements

This study was financially supported by the National Natural Science Fund of China (No. 50971020).

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Authors and Affiliations

  1. School of Mechatronic Engineering, Lanzhou Jiaotong University, Lanzhou, 730070, China

    Ke Chu

  2. School of Material Science and Engineering, University of Science and Technology Beijing, Beijing, 100083, China

    Chengchang Jia

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  1. Ke Chu
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  2. Chengchang Jia
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Correspondence to Ke Chu.

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Chu, K., Jia, C. On the thermal expansion of CNT/Cu composites for electronic packaging applications. Appl. Phys. A 111, 439–443 (2013). https://doi.org/10.1007/s00339-013-7634-2

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  • DOI: https://doi.org/10.1007/s00339-013-7634-2

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