Abstract
Pulsed UV laser ablation was explored as a means of removing thin (200 nm) gold films from one side of a transparent, thin (50 μm) quartz substrate. Single-pulse laser ablation (KrF excimer laser, 248 nm) was used to remove a top gold film without damaging the pre-patterned gold electrode deposited on the opposite side of the quartz substrate. Scanning electron microscope images were taken to evaluate the quality and consistency of the metal removal. It was found that the ablation threshold is 160 mJ/cm2 for 5 ns pulses. The highest-quality single-pulse ablation was observed with 200 mJ/cm2 for 5 ns pulses, and significant shielding was observed for fluences up to six times the ablation threshold for both 5 and 15 ns pulse durations. Further, the impact of increasing pulse energies upon the bottom electrode was measured, and a progression from pinhole formation to simultaneous removal of both gold films as a function of pulse intensity was determined.
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Acknowledgements
We gratefully acknowledge funding to establish the Photon Factory from MIRE at The University of Auckland. We also thank Rakon Limited in Auckland, New Zealand for providing samples.
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Rohde, C.A., Ware, H., MacMillan, F. et al. Selective gold film removal from multi-layer substrates with nanosecond UV pulsed laser ablation. Appl. Phys. A 111, 531–537 (2013). https://doi.org/10.1007/s00339-013-7617-3
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DOI: https://doi.org/10.1007/s00339-013-7617-3