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Metal-oxide-semiconductor characteristics of lanthanum cerium oxide film on Si

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Abstract

Metal-organic decomposed lanthanum cerium oxide (La x Ce y O z ) film had been spin-coated on n-type Si substrate. Effects of post-deposition annealing temperature and time on the metal-oxide-semiconductor (MOS) properties of the film were studied. As temperature increased from 400 to 1000°C for 15 minutes dwell time, La x Ce y O z demonstrated a decrease in interface trap density (D it) and total interface trap density (D total), which were related to the formation of SiO x /silicates interfacial layer (IL). The lowest leakage current density and highest dielectric breakdown voltage (V B) was obtained in 1000°C-annealed sample. When longer annealing times (30–120 minutes) were studied on the 1000°C-annealed sample, the sample annealed at 1000°C for 120 min showed the best MOS characteristics with V B of 30 V. Reasons contributing to such observation were discussed.

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Acknowledgements

One of the authors (W.F. Lim) would like to acknowledge financial support given by the Vice Chancellor’s Award, USM-RU-PRGS (8043001), and Malaysia Toray Science Foundation (MTSF) grant (6050205).

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Correspondence to Kuan Yew Cheong.

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Lim, W.F., Lockman, Z. & Cheong, K.Y. Metal-oxide-semiconductor characteristics of lanthanum cerium oxide film on Si. Appl. Phys. A 107, 459–467 (2012). https://doi.org/10.1007/s00339-012-6763-3

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