Abstract
Reducing the strain in brittle device layers is critical in the fabrication of robust flexible electronic devices. In this study, the cracking behavior of micro-patterned 500-nm-thick Ti films was investigated via uniaxial tensile testing by in situ SEM and 4-point probe measurements. Both visual observations by SEM and 4-pt resistance measurements showed that strategically patterned oval holes, off-set and rotated by 45°, had a significant effect on limiting the extent of cracking, specifically, in preventing cracks from converging. Failure with regard to electrical conduction was delayed from less than 2% to more than 10% strain.
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References
G.P. Crawford, Flexible Flat Panel Displays (Wiley, Chichester, 2005), pp. 263–282
E. Bonderover, S. Wagner, A woven inverter circuit for e-textile applications. IEEE Electron Device Lett. 25(5), 295–297 (2004)
T. Someya, T. Sekitani, S. Iba, Y. Kato, H. Kawaguchi, T. Sakurai, A large-area, flexible pressure sensor matrix with organic field-effect transistors for artificial skin applications. Proc. Natl. Acad. Sci. USA 101(27), 9966–9970 (2004)
T. Li, Z.Y. Huang, Z.C. Xi, S.P. Lacour, S. Wagner, Z. Suo, Delocalizing strain in a thin metal film on a polymer substrate. Mech. Mater. 37, 261–273 (2005)
N. Lu, X. Wang, Z. Suo, J. Vlassak, Metal films on polymer substrates stretched beyond 50%. Appl. Phys. Lett. 91, 221909 (2007)
Z. Suo, E.Y. Ma, H. Gleskova, S. Wagner, Mechanics of rollable and foldable film-on-foil electronics. Appl. Phys. Lett. 74(8), 1177–1179 (1999)
P. Mandlik, S.P. Lacour, J.W. Li, S.Y. Chou, S. Wagner, Fully elastic interconnects on nanopatterned elastomeric substrates. IEEE Electron Device Lett. 27(8), 650–652 (2006)
P. Ekkels, R.W. Tjerkstra, G.J.M. Krijnen, J.W. Berenschot, J. Brugger, M.C. Elwenspoek, Fabrication of functional structures on thin silicon nitride membranes. Microelectron. Eng. 67–68(1), 422–429 (2003)
P.I. Hsu, H. Gleskova, M. Huang, Z. Suo, S. Wagner, J.C. Sturm, Amorphous Si TFTs on plastically deformed spherical domes. J. Non-Cryst. Solids 299–302(2), 1355–1359 (2002)
S. Lacour, J. Jones, S. Wagner, T. Li, Z. Suo, Stretchable interconnects for elastic electronics surfaces. Proc. IEEE 93(8), 1459–1467 (2005)
W. Christiaens, T. Loeher, B. Pahl, M. Feil, B. Vandevelde, J. Vanfleteren, Embedding and assembly of ultrathin chips in multilayer flex boards. Circuit World 34(3), 3–8 (2008)
D. Verebelyi, E. Harley, J. Scudiere, A. Otto, U. Schoop, C. Thieme, N. Rupich, A. Maloyemoff, Practical neutral-axis conductor geometries for coated conductor composite wire. Supercond. Sci. Technol. 16, 1158–1161 (2003)
U.A. Handge, Y. Leterrier, G. Rochat, I.M. Sokolov, A. Blumen, Two scaling domains in multiple cracking phenomena. Phys. Rev. E 62(6), 7807–7810 (2000)
U.A. Handge, Analysis of a shear-lag model with nonlinear elastic stress transfer for sequential cracking of polymer coatings. J. Mater. Sci. 37, 4775–4782 (2002)
M. Heinrich, P. Gruber, S. Orso, U.A. Handge, R. Spolenak, Dimensional control of brittle nanoplatelets: a statistical analysis of a thin film cracking approach. Nano Lett. 6(9), 2026–2030 (2006)
S. Frank, U.A. Handge, S. Olliges, R. Spolenak, The relationship between thin film fragmentation and buckle formation: synchrotron-based in situ studies and two-dimensional stress analysis. Acta Mater. 57, 1442–1453 (2009)
Z.C. Xia, J.W. Hutchinson, Crack patterns in thin films. J. Mech. Phys. Solids 48, 1107–1131 (2000)
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Woo, N.C., Cherenack, K., Tröster, G. et al. Designing micro-patterned Ti films that survive up to 10% applied tensile strain. Appl. Phys. A 100, 281–285 (2010). https://doi.org/10.1007/s00339-010-5806-x
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DOI: https://doi.org/10.1007/s00339-010-5806-x