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Finite-element analysis of the mechanical behavior of Au/Cu and Cu/Au multilayers on silicon substrate under nanoindentation

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Abstract

Finite-element analysis of the nanoindentation into Au/Cu and Cu/Au multilayers was performed to deduce their mechanical characteristics from nanoindentation response. Different bilayer thicknesses, numbers, and sequences were studied using the load–displacement curve, hardness, indentation, and the residual surface profile as well as the von Mises equivalent stress. The characteristics of the multilayers were found to be dispersed between the Au and Cu. Nevertheless, if the indentation depth is smaller than the uppermost individual layer thickness of the multilayers, the intrinsic properties can be obtained. Using the von Mises equivalent stress as a failure criterion, the results showed that thinner multilayers would induce a greater potential of shear banding deformation.

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Authors and Affiliations

  1. Department of Engineering Science, National Cheng Kung University, Tainan, 701, Taiwan, R.O.C.

    Tong Hong Wang & Yu-Cheng Lin

  2. Thermal Laboratory, Advanced Semiconductor Engineering, Inc., Kaohsiung, 811, Taiwan, R.O.C.

    Tong Hong Wang

  3. Institute of Mechanical & Electromechanical Engineering, National Formosa University, Yunlin, 632, Taiwan, R.O.C.

    Te-Hua Fang

Authors
  1. Tong Hong Wang
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  2. Te-Hua Fang
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  3. Yu-Cheng Lin
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Correspondence to Yu-Cheng Lin.

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PACS

61.43.Bn; 62.20.-x; 68.03.Hj; 68.05.Cf; 68.08.De

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Wang, T., Fang, TH. & Lin, YC. Finite-element analysis of the mechanical behavior of Au/Cu and Cu/Au multilayers on silicon substrate under nanoindentation. Appl. Phys. A 90, 457–463 (2008). https://doi.org/10.1007/s00339-007-4303-3

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  • DOI: https://doi.org/10.1007/s00339-007-4303-3

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