Nanoindentation mapping of a wood-adhesive bond

Abstract

A mapping experiment of a wood phenol–resorcinol–formaldehyde adhesive bond was performed by means of grid nanoindentation. The variability of the modulus of elasticity and the hardness was evaluated for an area of 17 μm by 90 μm. Overall, the modulus of elasticity of the adhesive was clearly lower than the modulus of wood cell walls, whereas the hardness of the adhesive was slightly higher compared to cell walls. A very slight trend of decreasing modulus of elasticity was found with increasing distance from the immediate bond line. However, the trend was superimposed by a high variability of the modulus of elasticity in dependence on the position in the wood cell wall. The unexpectedly high variation of the modulus between 12 and 24 GPa may be explained by the interaction between the helical orientation of the cellulose microfibrils in the S2 layer of the wood cell wall and the geometry of the three-sided Berkovich type indenter pyramid used. Corresponding to the very slight decrease in modulus with increasing distance from the bond line, a similar but clearer trend was found for hardness. Both trends of changing mechanical properties of wood cell walls with varying distance from the bond line are attributed to effects of adhesive penetration into the wood cell wall.