Experimental study on the application of paraffin slurry to high density electronic package cooling

Abstract

Experiments were performed by using water and paraffin slurry to investigate thermal characteristics from a test multichip module. The parameters were the mass fraction of paraffin slurry (0, 2.5, 5, 7.5%), heat flux (10, 20, 30, 40 W/cm²) and channel Reynolds numbers. The size of paraffin slurry particles was within 10–40 μm. The local heat transfer coefficients for the paraffin slurry were larger than those for water. Thermally fully developed conditions were observed after the third or fourth row. The paraffin slurry with a mass fraction of 5% showed the most efficient cooling performance when the heat transfer and the pressure drop in the test section were considered simultaneously. A new correlation for the water and the paraffin slurry with a mass fraction of 5% was obtained for a channel Reynolds number over 5300.