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Fabrication and test of enhanced boiling heat transfer copper surface with micro-structure

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Abstract

In order to meet the efficient heat dissipation requirements of electronic chips, an enhanced boiling heat transfer copper surface was fabricated based on UV-LIGA and micro-electroforming technologies. Aiming at the removal difficulty of SU-8 photoresist in fabricating process, a method of preset swelling gap was proposed, simulated and experimented. Simulation and experimental results indicated that the optimal gap dimension is 14 μm. Then isolation layer material to fabricate the enhanced boiling heat transfer copper surface was discussed and BN308 photoresist was selected. Furthermore, surface condition was improved by oxygen plasma treatment. Finally, the enhanced boiling heat transfer copper surface was fabricated and tested. The statistic results demonstrated that the number of micro-columns with complete structure on the enhanced boiling heat transfer copper surface is 39,986 and the proportion is about 99.97%. The contact angle measurement results of the fabricated enhanced boiling heat transfer copper surface is 135°, illustrating that the surface is hydrophobic. The heat transfer performance testing results showed that the heat flux and the heat transfer coefficient of the fabricated enhanced boiling heat transfer copper surface is respectively 3.10 and 3.11 times than that of smooth copper surface. The fabricated enhanced boiling heat transfer copper surface has a relatively great heat transfer performance.

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Funding

This work was supported by the National Key R&D Program of China (2020YFB2009002) and the National Natural Science Foundation of China (51975103).

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Authors and Affiliations

  1. Key Laboratory for Micro/Nano Technology and System of Liaoning Province, School of Mechanical Engineering, Dalian University of Technology, 116024, Dalian, People’s Republic of China

    Liqun Du, Bingjiang Guo, Bowen Yuan, Xuechao Ji & Jingmin Li

  2. Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education, School of Mechanical Engineering, Dalian University of Technology, 116024, Dalian, People’s Republic of China

    Liqun Du

  3. Key Laboratory of Ocean Energy Utilization and Energy Conservation of Ministry of Education, School of Energy and Power Engineering, Dalian University of Technology, 116024, Dalian, People’s Republic of China

    Linsong Gao

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  1. Liqun Du
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  2. Bingjiang Guo
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  4. Bowen Yuan
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  5. Xuechao Ji
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Contributions

Liqun Du contributed to the conception of the study. Bingjiang Guo contributed significantly to analysis and wrote the manuscript. Linsong Gao conducted the performance testing. Bowen Yuan and Xuechao Ji contributed to the fabrication of copper surface. Jingmin Li helped perform the analysis with constructive discussions.

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Correspondence to Liqun Du.

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Du, L., Guo, B., Gao, L. et al. Fabrication and test of enhanced boiling heat transfer copper surface with micro-structure. Heat Mass Transfer 59, 1243–1255 (2023). https://doi.org/10.1007/s00231-022-03331-x

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  • DOI: https://doi.org/10.1007/s00231-022-03331-x

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