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A molecular dynamics study of phobic/philic nano-patterning on pool boiling heat transfer

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Abstract

Molecular dynamics (MD) simulations were employed to investigate the pool boiling heat transfer of a liquid argon thin film on a flat, horizontal copper wall structured with vertical nanoscale pillars. The efficacy of phobic/philic nano-patterning for enhancing boiling heat transfer was scrutinized. Both nucleate and explosive boiling modes were considered. An error analysis demonstrated that the typical 2.5σ cutoff in MD simulations could under-predict heat flux by about 8.7 %, and 6σ cutoff was chosen here in order to maintain high accuracy. A new coordination number criterion was also introduced to better quantify evaporation characteristics. Results indicate that the argon-phobic/philic patterning tends to either have no effect, or decrease overall boiling heat flux, while the argon-philic nano-pillar/argon-philic wall shows the best heat transfer performance.

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Abbreviations

e i :

Per-atom energy (eV)

E :

Potential energy (eV)

F i :

Force (eV/Å)

h fg :

Latent heat of vaporization (kJ/kg)

k b :

Boltzmann constant (eV/K)

m i :

Mass (g)

q :

Heat flux (W/m2)

q max :

Maximum attainable heat flux (W/m2)

r :

Interparticle distance (Å)

r c :

Cutoff distance (Å)

R :

Ideal gas constant (kJ/kg K)

S i :

Per-atom stress tensor (eV)

T :

Absolute temperature (K)

v i :

Velocity (Å/ps)

V i :

Volume (Å3)

x i :

Distance (Å)

ε:

Lennard-Jones potential well depth (eV)

η d :

Damping coefficient

ρ g :

Saturated vapor density (kg/m3)

σ:

Lennard-Jones characteristic length (Å)

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Authors and Affiliations

  1. Department of Mechanical and Aerospace Engineering, Rutgers, The State University of New Jersey, Piscataway, NJ, 08854, USA

    Ricardo Diaz & Zhixiong Guo

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  1. Ricardo Diaz
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  2. Zhixiong Guo
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Correspondence to Zhixiong Guo.

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Diaz, R., Guo, Z. A molecular dynamics study of phobic/philic nano-patterning on pool boiling heat transfer. Heat Mass Transfer 53, 1061–1071 (2017). https://doi.org/10.1007/s00231-016-1878-2

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