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Application of thermal convection to stability analysis of lithograph

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Abstract

Thermal conduction and thermal convection are two major cooling methods. The experiment applies these two methods simultaneously to cool photo-masks. The combination of thermal conduction and thermal convection can solve the problems of thermal expansion of masks during long-term exposure. Highly thermal conductive material can conduct heat that accumulates on chromium to the diamond film. However, heat that is conducted on the diamond film is not easily discharged into the air. Therefore, a thermal convection method to cool a diamond film is designed. The method involves blowing N 2 gas at 23°C onto the surface of masks.

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References

  1. Kuo Yang-Kuao, Chao Chuen-Guang, Lin Chi-Yuan (2004) Analysis of instability line width and white wall created by the photolithography process. Microelectronics Journal 35:915–922

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  2. Yang-Kuao Kuo, Chuen-Guang Chao (2005) Analysis of the effects of reflectance and refraction generated by wafers made from fused silica, ALOxNy and TiSixNy under different light sources on pattern length and best focus. Microelectron J 36:35–39

  3. Yang-Kuao Kuo, Chuen-Guang Chao, Chi-Yuan Lin (2005) Analysis of instability in a critical dimension bar due to focus and exposure. Mater Sci Semicond Process 8(4):483–490

  4. Plummer J, Deal M, Griffin P (2000) Silicon VLSI technology—fundamentals practice and modeling. Prentice Hall, New Jersey

    Google Scholar 

  5. Mack CA (2004) 30 years of lithography simulation. In: Optical Microlithography XVIII, proceedings of SPIE, vol 5754, pp 1–12

  6. Schellenberg F (2004) Resolution enhancement technology: the past, the present, and extensions for the future. In: Optical Microlithography XVII, proceedings of SPIE, vol 5377, pp 1–20

  7. Wong AK-K (2001) Resolution enhancement techniques in optical lithography, SPIE Press, Bellingham, Washington

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Correspondence to Yang-Kuao Kuo.

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Kuo, YK. Application of thermal convection to stability analysis of lithograph. Heat Mass Transfer 47, 1395–1399 (2011). https://doi.org/10.1007/s00231-011-0798-4

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  • DOI: https://doi.org/10.1007/s00231-011-0798-4

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