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Effect of plated helix on heat dissipation capability of the slow-wave circuit

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Abstract

The effect of plated helix on heat dissipation capability of the slow-wave circuit is studied in this paper. With the plated helix, the improvement of the heat dissipation capability of the slow-wave circuit is estimated and evaluated. The influence of helices coated with copper film and gold film is analyzed and verified by computer simulation and experimental tests. The tests show good agreement with the theoretical analysis. The conclusions will make good reference to the design and improvement of the helix TWT.

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Authors and Affiliations

  1. Institute of Electronics, Chinese Academy of Sciences, Beijing, 100190, China

    Yong Han, Yanwen Liu, Yaogen Ding, Pukun Liu & Chunhua Lu

  2. Graduate University of Chinese Academy of Sciences, Beijing, 100039, China

    Yong Han

  3. P.O. Box 2652, BeiSiHuan West Road, Beijing, HaiDian, China

    Yong Han

Authors
  1. Yong Han
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  2. Yanwen Liu
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  3. Yaogen Ding
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  4. Pukun Liu
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  5. Chunhua Lu
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Corresponding author

Correspondence to Yong Han.

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Han, Y., Liu, Y., Ding, Y. et al. Effect of plated helix on heat dissipation capability of the slow-wave circuit. Heat Mass Transfer 45, 93–98 (2008). https://doi.org/10.1007/s00231-008-0401-9

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  • DOI: https://doi.org/10.1007/s00231-008-0401-9

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