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Electromagnetic interference shielding material from electroless copper plating on birch veneer

Abstract

Copper coating on birch veneer substrate was conducted by electroless deposition to prepare electromagnetic interference shielding material. In the process, Pd2+ ions were chemically adsorbed on the wood surface modified with chitosan. Then, they were reduced and dipped into a plating bath where copper film was successfully initiated. The coatings were characterized by SEM–EDS, XPS, and XRD. The metal deposition, surface resistivity, and electromagnetic shielding effectiveness were measured. The morphology of the coating observed by SEM is uniform, compact, and continuous. EDS, XPS, and XRD results showed that the coating consists of Cu0 with crystalline structure. Moreover, the copper films firmly adhere to the wood surface. Birch veneers plated with crystalline copper film exhibit high electro-conductivity with surface resistivity of 119.1 mΩ cm−2 and good electromagnetic shielding effectiveness of over 60 dB in frequencies ranging from 10 MHz to 1.5 GHz.

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Acknowledgments

The authors gratefully acknowledge the Natural Science Foundation of Heilongjiang Province (C200906), and the Program for NCET (08-0752).

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Correspondence to Lijuan Wang.

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Sun, L., Li, J. & Wang, L. Electromagnetic interference shielding material from electroless copper plating on birch veneer. Wood Sci Technol 46, 1061–1071 (2012). https://doi.org/10.1007/s00226-012-0466-y

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  • DOI: https://doi.org/10.1007/s00226-012-0466-y

Keywords

  • Chitosan
  • Surface Resistivity
  • Energy Dispersive Spectrometer
  • Wood Surface
  • Electroless Plating