Abstract
The interference of copper based preservative treated southern yellow pine (SYP) on the cure of phenol-formaldehyde adhesives was investigated by using differential scanning calorimetry (DSC). Copper preservatives used in this study include copper azole (NS), alkali copper quat (ACQ)-type C (NW). Three commercial phenol-formaldehyde (PF) adhesives used for oriented strand board (OSB) face area, core area and a plywood adhesive were studied. The curing peak temperature and peak time of OSB core and face PF resin shifted to higher temperature and duration in the presence of CCA, NS, and NW-treated SYP compared to that in untreated SYP. The above treatments interfere with the cure of OSB core and face PF resin. Untreated SYP showed a curing accelerating effect on the cure of plywood adhesive, but the accelerating effect of copper-treated SYP on the cure of plywood resin was not significant.
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References
Amen-Chen C, Riedl B, Wang X, Roy C (2002a) Softwood bark pyrolysis oik-PF resols: Part 1. Resin synthesis and OSB mechanical properties. Holzforschung 56:167–175
Amen-Chen C, Riedl B, Roy C (2002b) Softwood bark pyrolysis oik-PF resols: Part 2. Thermal analysis by DSC and TG. Holzforschung 56:273–280
ASTM E 2160 (2004) Standard test method for heat of reaction of thermally reactive materials by differential scanning calorimetry
Frihart CR (2003) Interaction of copper wood preservatives and adhesives. In: Proceedings of the twenty-sixth annual meeting of the adhesion society, Myrtle Beach, pp 244–245
Kamdem DP, Freeman M, Schmidt E, Nzokou P (2002) Waterborne copper naphthenate: a potential new preservative for softwoods, hardwoods, and composites. In: Proceedings of conference on enhancing the durability of lumber and engineered wood products, Kissimme, pp 73–80
Miyazaki J, Nakano T, Hirabayashi Y, Kishino M (1999) Effects of wood preservatives on adhesive properties of phenol-resorcinol-formaldehyde resin. Mokuzai Gakkaishi 45(1):34–41
Pizzi A (1979) Phenolic and tannin-based adhesive resin by reactions of coordinated metal ligands. I. Phenolic chelates. J Appl Polym Sci 24:1247–1255
Pizzi A (1983) Wood adhesive chemistry and technology. Marcel Dekker, New York
Pizzi A, Mtsweni B, Parsons W (1994) Wood-induced catalytic activation of PF adhesives autopolymerization versus PF/wood covalent bonding. J Appl Polymer Sci 52:1847–1856
Vick CB, Christiansen AW (1993) Cure of phenol-formaldehyde adhesive in the presence of CCA-treated wood by differential scanning calorimetry. Wood Fiber Sci 25(1):77–86
Vick CB, Geimer RL, Wood JE (1996) Flakeboards from recycled CCA-treated sorthern pine lumber. For Prod J 46(11/12):89–91
Acknowledgments
The authors acknowledge Michigan State University-USDA/CSREES Eastern Hardwood Utilization Program, grant No. 2002-34158-11914 for providing funds. We would like to express our gratitude to Georgia Pacific Corporation as well as Osmose Inc., for providing PF adhesives and preservative-treated wood. Technical support from Perkin-Elmer Instruments is also greatly appreciated.
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Jiang, H., Kamdem, D.P. Differential scanning calorimetry characterization of the cure of phenol-formaldehyde adhesive in the presence of copper-based preservative treated wood. Wood Sci Technol 41, 637–644 (2007). https://doi.org/10.1007/s00226-007-0125-x
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DOI: https://doi.org/10.1007/s00226-007-0125-x