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Assessment of sustainable and machinable performance metrics of monocrystalline silicon carbide wafer with electrophoretic-assisted multi-diamond wire sawing

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Abstract

The rapacious demand for energy in semiconductor wafer manufacturing industries has significant implications for global warming and wafer manufacturing costs. Assessing sustainability in the multi-diamond wire sawing (MDWS) process is crucial for reducing costs and mitigating environmental impacts. However, sustainable assessment integrated with machinable performance metrics in this process has not been investigated. This novel study extensively analyzes sustainability metrics such as processing time, energy consumption, carbon dioxide emissions, machining cost, and machinability characteristics, including surface roughness, diamond wear rate, and sawing temperature in monocrystalline silicon carbide (mono-SiC) sawing process. Experiments were conducted using traditional MDWS (T-MDWS), reactive MDWS (R-MDWS), and electrophoretic-assisted reactive MDWS (ER-MDWS) coolants. An autoregressive integrated moving average (ARIMA) model was used to predict the overall energy consumption of the MDWS machine. Results showed significant improvements across various responses such as processing time, energy consumption, carbon dioxide emissions, machining cost, surface roughness, diamond wear rate, and sawing temperature, with reductions of 2.95%, 3.87%, 6.80%, 12.82%, 4.68%, 16.32%, and 4.39%, respectively. Furthermore, the ARIMA model results indicate that the total energy consumption prediction accuracy reaches 98.813%. The findings demonstrated that the ER-MDWS cooling strategy is well-suited for large-scale wafer production without compromising surface quality while minimizing environmental impact.

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Acknowledgements

The authors acknowledge the financial support of the National Science and Technology Council (NSTC) under grant number (NSTC 112-2221-E-011-096). We also thank the Green Energy and Environment Research Laboratories (GEL) at the Industrial Technology Research Institute (ITRI) in Taiwan for their support and assistance with the digital power meters.

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Authors and Affiliations

  1. Department of Mechanical Engineering, National Taiwan University of Science and Technology, No. 43, Keelung Rd, Sec.4, Da’an Dist., Taipei, 10607, Taiwan

    Eyob Messele Sefene, Yueh-Hsun Tsai, Ting-Huan Lai & Ding-Xuan Huang

  2. CMP Innovation Center, National Taiwan University of Science and Technology, No. 43, Keelung Rd, Sec.4, Da’an Dist., Taipei, 10607, Taiwan

    Chao-Chang Arthur Chen

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  1. Eyob Messele Sefene
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Contributions

Eyob Messele Sefene: conceptualization, methodology, investigation, data curation, formal analysis, software, validation, writing—original draft, and writing—review and editing. Chao-Chang Arthur Chen: conceptualization, visualization, formal analysis, validation, resources, funding acquisition, and project administration. Yueh-Hsun Tsai: methodology and data curation. Ting-Huan Lai: investigation and data curation. Ding-Xuan Huang: investigation and data curation. All authors have read and agreed to the published version of the manuscript.

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Correspondence to Chao-Chang Arthur Chen.

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Sefene, E.M., Chen, CC.A., Tsai, YH. et al. Assessment of sustainable and machinable performance metrics of monocrystalline silicon carbide wafer with electrophoretic-assisted multi-diamond wire sawing. Int J Adv Manuf Technol (2024). https://doi.org/10.1007/s00170-024-13664-y

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