Abstract
A high pulsed fiber laser was utilized to drill square microholes in Si3N4 sheets in an atmospheric environment. Various processing parameters including scan spacing, number of scan passes, and number of multi-ring paths with a multi-ring strategy were adjusted to laser-drill Si3N4 sheets. The geometric characteristics of laser-drilled square microholes with shoulder height, taper angle, and corner radius were measured using a laser scanning microscope. X-ray diffraction was applied to examine the residual stress of the Si3N4 sheets before and after laser drilling. Moreover, the heat-affected zone and element content were examined using a scanning electron microscope. The experimental results exhibited that the optimal shoulder height of the square microhole drilled with the multi-ring strategy was 6.67 ± 0.21 μm, which was approximately 77% lower than that of 29.05 ± 10.95 μm for the square microhole drilled with the single-ring strategy. Moreover, the residual stresses of the original Si3N4 sheet and the square microholes laser-drilled by single-ring and multi-ring strategies were − 181.2 ± 41, 164.5 ± 31.9, and 104.6 ± 7.8 MPa, respectively. The proposed laser drilling technology with the multi-ring strategy can be widely used in the semiconductor industry for probe cards.
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The authors appreciate the National Science and Technology Council of Taiwan under Project Nos. MOST 111-2628-E-027-005-MY2 and NSTC 112-2622-E-027-012 for financial support.
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Shih-Feng Tseng: Conceptualization; Investigation; Methodology; Project administration; Formal analysis; Writing- Original draft; Writing- Reviewing and Editing. Guan-Lin Chen: Data curation; Software; Investigation; Validation. Chien-Yao Huang: Conceptualization; Methodology; Validation. Donyau Chiang: Investigation; Validation. Chil-Chyuan Kuo: Conceptualization; Investigation; Formal analysis.
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Tseng, SF., Chen, GL., Huang, CY. et al. Investigation of interactions between fiber lasers and Si3N4 sheets for drilling square microholes with multi-ring strategy. Int J Adv Manuf Technol 132, 1557–1572 (2024). https://doi.org/10.1007/s00170-024-13383-4
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DOI: https://doi.org/10.1007/s00170-024-13383-4