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Micro-cutting mechanism of selective laser melting AlSi10Mg containing inside metal particles based on finite element analysis

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Abstract

Micro-cutting processes, such as single-point diamond turning, are required for selective laser melting (SLM)–fabricated AlSi10Mg to machine optical mirrors. During the SLM process, cross contamination can often introduce the different metal particle into the AlSi10Mg workpiece, inducing various surface defects (concaves and scratches) on the micro-cutting machined surface. To find the micro-cutting mechanism of SLM AlSi10Mg containing the inside metal particle, the micro-cutting process was simulated using finite element analysis (FEA). The surface morphology formation mechanisms of the SLM AlSi10Mg containing the inside metal particle during the micro-cutting process were investigated. A scratch was created on the AlSi10Mg surface when the tool was at the upper part of the inside metal particle. A concave was formed due to the entire removal of the inside metal particle when the tool acted at the lower part of the particle. The proposed model was proven efficient and accurate by verifying the above mechanism with the machined surface morphologies. This paper provides a FEA example for the micro-cutting process of alloy matrix containing the inside metal particle.

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Acknowledgements

The authors gratefully acknowledge the great support from the National Natural Science Foundation of China (NSFC) (No. 62105244).

Funding

This work was supported by the National Natural Science Foundation of China (NSFC) (No. 62105244).

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Authors and Affiliations

  1. Key Laboratory of Advanced Micro-structured Materials, Ministry of Education, Tongji University, Siping Road, Shanghai, 200092, China

    Yifan Wang, Jun Yu, Chunling He & Zhanshan Wang

  2. Institute of Precision Optical Engineering, School of Physics Science and Engineering, Tongji University, Siping Road, Shanghai, 200092, China

    Yifan Wang, Jun Yu, Chunling He & Zhanshan Wang

  3. School of Mechanical Engineering, Tongji University, Siping Road, Shanghai, 200092, China

    Kun Wang

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  1. Yifan Wang
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Correspondence to Jun Yu.

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Wang, Y., Yu, J., Wang, K. et al. Micro-cutting mechanism of selective laser melting AlSi10Mg containing inside metal particles based on finite element analysis. Int J Adv Manuf Technol 128, 4123–4137 (2023). https://doi.org/10.1007/s00170-023-12154-x

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