Abstract
For the drilling of micro-holes using micro-EDM technology, it is not easy for debris to be removed from the narrow gap. Aiming at this issue, a relative three-dimensional ultrasonic vibration (RTDUV)-assisted micro-EDM method was proposed to effectively improve the debris removal rate and micro-hole machining performance. The RTDUV consists of circular electrode vibration and vertical workpiece vibration. To better analyze the impact of RTDUV assistance on flow field distribution and debris removal, a flow field simulation was conducted. Micro-hole drilling experiments were conducted to investigate the machining performance with RTDUV assistance. From the simulation results, it is known that RTDUV assistance effectively accelerates debris removal in micro-hole machining, and the debris removal rate with RTDUV assistance is higher than that with the assistances electrode vibration (EV) and workpiece vibration (WV). Compared with the case without vibration assistance, EV, WV, and RTDUV assistances improved the consistency accuracy of the arrayed micro-hole (10 × 10) entrance by 24.8%, 21%, and 33.8% respectively, and the inlets of micro-holes have better morphologies under RTDUV assistance. The machining efficiency when using RTDUV assistance has been improved by 19.5%. The advantage of RTDUV assisted micro-EDM is that the lateral and underside gaps are in an alternating state, which greatly promotes the removal of discharge debris in the discharge gap and increases the renewal rate of the gap dielectric. Consequently, the reduction in processing stability caused by the high concentration of gap debris is avoided to some extent. The proposed novel ultrasonic vibration assistance method is prospective to further enhance the performance of micro-EDM.
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Funding
This work was supported by the National Natural Science Foundation of China (No. 51575137), the Key Project of Natural Science Foundation of Heilongjiang Province of China (No. ZD2019E005), and the National Natural Science Foundation of China (No. 51975156).
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Shaojie Hou: conceptualization, methodology, writing—original draft preparation, investigation, data curation, visualization, and editing. Jicheng Bai: supervision, project administration, funding acquisition, and writing—review.
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Hou, S., Bai, J. A novel ultrasonic vibration-assisted micro-EDM method to improve debris removal performance using relative three-dimensional ultrasonic vibration (RTDUV). Int J Adv Manuf Technol 127, 5711–5727 (2023). https://doi.org/10.1007/s00170-023-11971-4
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DOI: https://doi.org/10.1007/s00170-023-11971-4