Abstract
Aiming at clarifying the effective mechanism of ethylenediamine additive on the glazed phenomenon of fixed abrasive pad (FAP) under deionized water polishing slurry condition, tribological experiments were carried out with W3-5 diamond hydrophilic FAP and silica glass workpiece. The influence of ethylenediamine on the FAP surface glazed phenomenon was studied by analyzing the friction coefficient, FAP surface morphology and hardness, workpiece surface morphology, and material removal rate (MRR) after the experiments. The results show that the ethylenediamine can significantly prolong the FAP service life. With the increase of ethylenediamine concentration, the FAP glazed time first increased and then decreased, and the biggest value was observed in the 4% ethylenediamine concentration. Besides, the concentration increasing of the ethylenediamine promotes the softening layer formation on the workpiece surface, and the bigger surface roughness value of it is obtained. Detailed analysis shows that the FAP surface hardness is reduced due to the reaction between the ethylenediamine and the copper exposed on its surface. Thus, the swelling layer of FAP is rapidly softened and removed, and the fresh abrasives are exposed at this case. So, a high material removal ability of FAP is obtained for a longer time, and the surface glazed phenomenon is restrained.
Similar content being viewed by others
Data availability
All data generated or analyzed during this study are included in this manuscript.
References
Tian Y, Li L, Han J, Fan Z, Liu K (2021) Development of novel high-shear and low-pressure grinding tool with flexible composite. Mater Manuf Process 36(4):479–487. https://doi.org/10.1080/10426914.2020.1843673
Su J, Liu H, Qi W, Cao X, Wang Z (2020) Selection of abrasive for chemical mechanical polishing of the 304 stainless steel. J Phys: Conf Ser 1681(1):1–5. https://doi.org/10.1088/1742-6596/1681/1/012011
Zhong Z, Tian Y, Ng J, Ang Y (2014) Chemical mechanical polishing (CMP) processes for manufacturing optical silicon substrates with shortened polishing time. Adv Manuf Process 29(1):15–19. https://doi.org/10.1080/10426914.2013.852206
Liao L, Zhang Z, Liu J, Li Y, Cui X, Liu L (2020) A novel process of chemical mechanical polishing for FV520B steel. J Manuf Process 59:51–57. https://doi.org/10.1016/j.jmapro.2020.09.052
Wei C, Tian Y, Chowdhury S, Han J, Gu Z (2023) Investigation on high-shear and low-pressure grinding characteristics for zirconia ceramics using newly developed flexible abrasive tool. Ceram Int 49(6):8725–8735. https://doi.org/10.1016/J.CERAMINT.2022.10.265
Lu H, Fookes B, Obeng Y, Machinski S, Richardson K (2002) Quantitative analysis of physical and chemical changes in CMP polyurethane pad surfaces. Mater Charact 49(1):35–44. https://doi.org/10.1016/S1044-5803(02)00285-1
Zhou Y, Luo H, Pan G, Zou C, Luo G, Chen G, Kang C (2018) Study on pad performance deterioration in chemical mechanical polishing (CMP) of fused silica. ECS J Solid State Sc 7(6):295–298. https://doi.org/10.1149/2.0011806jss
Hooper B, Byrne G, Galligan S (2002) Pad conditioning in chemical mechanical polishing. J Mater Process Tech 123(1):107–113. https://doi.org/10.1016/S0924-0136(01)01137-2
Wang Z, Yang Y, Zhang Z, Pang M, Liang M, Ma L, Su J (2023) A novel technique for dressing fixed abrasive lapping pad with abrasive water Jet. Int J Pr Eng and Man-GT 2023:1–23. https://doi.org/10.1007/s40684-022-00500-5
Tsai M, Yang W (2012) Combined ultrasonic vibration and chemical mechanical polishing of copper substrates. Int J Mach Tool Manuf 53(1):69–76. https://doi.org/10.1016/j.ijmachtools.2011.09.009
Tomita Y, Eda H (1996) A study of the ultra precision grinding process on a magnetic disk substrate—development of new bonding materials for fixed abrasives of grinding stone. Wear 195(1-2):74–80. https://doi.org/10.1016/0043-1648(95)06792-2
Choi J, Jeong H (2004) A study on polishing of molds using hydrophilic fixed abrasive pad. Int J Machine Tool Manuf 44(11):1163–1169. https://doi.org/10.1016/j.ijmachtools.2004.04.006
Zheng F, Zhu N, Zhu Y, Li X, Li J, Zuo D (2017) Self-conditioning performance of hydrophilic fixed abrasive pad. Int Jdv Manuf Tech 90(5-8):2217–2222 https://doi.org/10.1007/s00170-016-9553-9
Cho B, Kim H, Manivannan R, Moon D, Park J (2013) On the mechanism of material removal by fixed abrasive lapping of various glass substrates. Wear 302(1-2):1334–1339. https://doi.org/10.1016/j.wear.2012.11.024
Wang Z, Pang M, Liang M, Wang J, Ma L, Liu H, Han J, Zhu Y, Su J (2021) Effect of material structure on spinel machinability in its fixed abrasive lapping. J Manuf Process 68:141–153. https://doi.org/10.1016/J.JMAPRO.2021.05.035
Wang H, Niu F, Chen J, Jiang Z, Wang W, Bu Z, Wang X, Li J, Zhu Y, Sun T (2022) High efficiency polishing of silicon carbide by applying reactive non-aqueous fluids to fixed abrasive pads. Ceram Int 48(5):7273–7282. https://doi.org/10.1016/J.CERAMINT.2021.11.288
Kim H, Kim H, Jeong H, Seo H, Lee S (2003) Self-conditioning of encapsulated abrasive pad in chemical mechanical polishing. J Mater Process Tech 142(3):614–618. https://doi.org/10.1016/S0924-0136(03)00641-1
Kim H, Park B, Lee S, Jeong H, Dornfeld D (2019) Self-conditioning fixed abrasive pad in CMP. J Electrochem Soc 151(12):858–862. https://doi.org/10.1149/1.1813951
Zhu Y, Wang C, Xu J, Li J (2014) Influence of pore distribution of fixed abrasive pad on its machining performance. Optics Precis Eng 266(4):911–917. https://doi.org/10.3788/OPE.20142204.0911
Li J, Huang J, Xia L, Zhu Y, Zuo D (2016) Effect of chemical additive on fixed abrasive pad self-conditioning in CMP. Int J Adv Manuf Tech 88(1-4):1–7. https://doi.org/10.1007/s00170-016-8771-5
Zheng F, Zhu N, Zhu Y, Li X, Li J (2016) Self-conditioning performance of hydrophilic fixed abrasive pad. Int J Adv Manuf Tech 90(5-8):1–6. https://doi.org/10.1007/s00170-016-9553-9
Wang Z, Pang M, Liang M, Yao J, Ma L (2020) The effect of slurries on lapping performance of fixed abrasive pad for Si3N4 ceramics. Sci Progress-UK 103(4):1–18. https://doi.org/10.1177/0036850420982451
Tang X, Zhu Y, Fu J, Wang C, Ju Z (2012) Influence of copper content on the machining performance of hydrophilic fixed abrasive pad. Diam Abrasive Eng 32(4):10–13. https://doi.org/10.13394/j.cnki.jgszz.2012.04.009
Hughes M, Mcmaster R, Proctor J, Hewak D, Suzuki T, Ohishi Y (2022) High pressure photoluminescence of bismuth-doped yttria-alumina-silica glass. High Pressure Res 42(1):94–104. https://doi.org/10.1080/08957959.2022.2044031
Qiao Q, Xiao T, He H, Yu J (2021) Hydrogen ion induced mechanochemical wear of soda lime silica glass in acid solutions. J Non-Cryst Solids 552(2):1–8. https://doi.org/10.1016/j.jnoncrysol.2020.120440
Satake U, Enomoto T (2014) Evaluation of polishing pad property by rubber hardness test-estimating edge surface flatness of workpiece. Procedia Cirp 14:329–332
Zeng S, Blunt L (2013) Experimental investigation and analytical modelling of the effects of process parameters on material removal rate for bonnet polishing of cobalt chrome alloy. Pr Eng 38(2):348–355. https://doi.org/10.1016/j.precisioneng.2013.11.005
Wang Z, Niu F, Zhu Y, Li J, Wang J (2019) Comparison of lapping performance between fixed agglomerated diamond pad and fixed single crystal diamond pad. Wear 432:1–8. https://doi.org/10.1016/j.wear.2019.202963
Tsai T, Wu Y, Yen S (2003) A study of copper chemical mechanical polishing in urea-hydrogen peroxide slurry by electrochemical impedance spectroscopy. Appl Surf Sci 214(1-4):120–135. https://doi.org/10.1016/S0169-4332(03)00272-1
Yair E, David S (2007) Review on copper chemical-mechanical polishing (CMP) and post-CMP cleaning in ultra large system integrated (ULSI)-an electrochemical perspective. Electrochim Acta 52(5):1825–1838. https://doi.org/10.1016/j.electacta.2006.07.039
Zeidler D, Stavreva Z, Plӧtner M, Drescher K (1997) The interaction between different barrier metals and the copper surface during the chemical-mechanical polishing. Microelectron Eng 37-38:237–243. https://doi.org/10.1016/S0167-9317(97)00117-2
Muller G, Voronova K, Sztaray B, Meloni G (2016) Rotamers and migration: investigating the dissociative photoionization of ethylenediamine. J. Phys. Chem. A 120(22):3906–3916. https://doi.org/10.1021/acs.jpca.6b03516
Cook L (1990) Chemical processes in glass polishing. J Non-Cryst Solids 120(1-3):152–171. https://doi.org/10.1016/0022-3093(90)90200-6
Lee W, Chang H (2005) Effect of slurry pH on the defects induced during the plug isolation chemical mechanical polishing. Thin Solid Films 489(1/2):145–149. https://doi.org/10.1016/j.tsf.2005.04.101
Funding
This study was supported by the National Natural Science Foundation of China (U1804142, 52175397) and key scientific research projects of colleges and universities in Henan Province (20A460002).
Author information
Authors and Affiliations
Corresponding author
Ethics declarations
Ethics approval
Not applicable.
Consent to participate
All authors agree to participate.
Consent for publication
All authors agree to publication.
Competing interests
The authors declare no competing interests.
Additional information
Publisher’s note
Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.
Rights and permissions
Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law.
About this article
Cite this article
Pang, M., Wu, Y., Wang, Z. et al. Effect of ethylenediamine on the surface glazed phenomenon of fixed abrasive pad under deionized water condition. Int J Adv Manuf Technol 128, 1049–1061 (2023). https://doi.org/10.1007/s00170-023-11961-6
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s00170-023-11961-6