Abstract
Ultrasonic-assisted machining of silicon carbide (SiC) ceramic matrix composites (CMCs) has the ability to decrease grinding force and improve processing quality. The machining process often produces large cutting forces which cause defects, such as delamination and burrs, due to the brittleness and high hardness of the material. Therefore, it is significant to precisely predict the grinding force. In published literature, the modelling of cutting force has been investigated based on brittle removal assumption. However, a ductile flow phenomenon exists simultaneously during the micro-grinding of CMCs. Hence, in this paper, we present an analytical model of grinding force with the consideration of ductile–brittle transition. Additionally, the critical cutting depth for removal mode transition can be applied to distinguish the ductile and brittle fracture removal processes. The establishment of the analytical model was on the basis of the research of single abrasive grain, including motion trajectory, micromechanical analysis, cutting time, and removal volume in ductile and brittle fracture processes during one cutting cycle. Thereafter, the final model was proposed with respect to the quantity of active abrasive grains in the cutting area. The trend of the experiment results was in good agreement with the predicted values of the analytical model.
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The datasets analyzed during the current study are available from the corresponding author on reasonable request.
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Acknowledgements
The authors deeply acknowledge the Key Laboratory of High Performance Manufacturing for Aero Engine (Northwestern Polytechnical University) and Engineering Research Center of Advanced Manufacturing Technology for Aero Engine (Northwestern Polytechnical University) for providing us with the ability to conduct this research.
Funding
This work was co-supported by the National Natural Science Foundation of China (nos. 51875473 and 91960203) and the Science Center for Gas Turbine Project (P2021-A-IV-003–001).
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Menghua Zhang: methodology, validation, writing—original draft. Ziwen Xia: visualization, investigation. Chenwei Shan: conceptualization, methodology, supervision, funding acquisition, writing—review and editing. Ming Luo: supervision, writing—review and editing.
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Zhang, M., Xia, Z., Shan, C. et al. Analytical model of grinding force for ultrasonic-assisted grinding of Cf/SiC composites. Int J Adv Manuf Technol 126, 2037–2052 (2023). https://doi.org/10.1007/s00170-023-11257-9
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DOI: https://doi.org/10.1007/s00170-023-11257-9