Abstract
Diamond wire sawing (DWS) is often used to cut and slice crystalline silicon. The machining accuracy of DWS is a key performance of wire sawing. However, due to the inconsistent deformation of diamond wire relative to the workpiece in different sawing directions, the machining accuracy is different. In this paper, the machining accuracy of DWS in rip sawing and cross sawing was compared. Sawing tests were designed for rip sawing and cross sawing in different feed directions. The length of sawing kerf was used for the evaluation of machining accuracy. It was found that the machining accuracy of diamond wire pushing the workpiece (rip +) is obviously better than that of pulling the workpiece (rip −) in rip sawing as the wire stiffness of rip + is higher. The machining accuracy of cross sawing in different feed directions is related not only to wire stiffness, but also related to the wire torsion produced by lateral feed force in cross sawing. Therefore, the order of machining accuracy 1X + > 4Y − > 2Y + > 3X − shows that the cross sawing accuracy does not show an obvious law relative to rip sawing. A diamond wire electrical discharge sawing (DWEDS) was proposed in rip sawing and cross sawing to compare the machining accuracy of DWS. It was found that the machining accuracy of DWEDS is higher than that of DWS. No significant differences were found in machining accuracy between rip sawing and cross sawing in DWEDS. Finally, the characteristics of cutting force in time–frequency domain were analyzed.
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Funding
This work was supported by Key Research and Development Program of Shandong Province, China (No. 2022CXGC010201), by allowing the facilities to conduct this work.
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Jian Qiu: conceptualization, methodology, data curation, software, writing — original draft, visualization, validation, program. Jianzhuang Lv: validation.
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Qiu, J., Lv, J. Machining accuracy and force characteristic of diamond wire sawing and diamond wire electrical discharge sawing during rip sawing and cross sawing. Int J Adv Manuf Technol 126, 697–707 (2023). https://doi.org/10.1007/s00170-023-11132-7
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DOI: https://doi.org/10.1007/s00170-023-11132-7