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Research on the influence of limit wire guide on high thickness cutting of micro high-speed WEDM

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Abstract

In order to further improve the process index of high-thickness cutting of micro high-speed wire electrical discharge machining (micro-WEDM), a self-limiting wire guide (SWG) device was designed, which realized high-performance cutting of workpieces with a thickness of 20 mm by using Φ80 μm wire electrode. The modal simulation results show that the SWG device can increase the natural frequency of the wire electrode and can buffer and isolate the vibration of the wire electrode. Under the same processing conditions, compared with unlimited device processing, the SWG device processing is more stable. The average surface roughness Ra is 2.4 μm, which is 35% lower than that of without limiting device, and there is no obvious reversal stripe on the surface. The uniformity of kerf width and the consistency of cutting size are better. The corner error is reduced by 63.5% when machining a 90° convex corner, and the material removal rate is relatively increased by 7%.

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Funding

This work was supported by the Science and Technology Plan Project of Changzhou (Basic Research for Application) (CJ20220075), the Natural Science Foundation of the Jiangsu Higher Education Institutions of China (22KJB460019), and the National Natural Science Foundation of China (Grant No. 51975264). We also extend our sincere thanks to all who contributed to the preparation of this manuscript.

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Authors and Affiliations

  1. School of Mechanical Engineering, Jiangsu University of Technology, Changzhou, 213001, China

    Suorong Zhang, Guoyan Chen, Linglei Kong & Weining Lei

  2. College of Mechanical Engineering, Suzhou University of Science and Technology, Suzhou, 215101, China

    Ming Zhang

  3. School of International Economics and Management, Beijing Technology and Business University, Haidian District, 33 Fucheng Road, Beijing, 100048, China

    Haojue Zhang

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  1. Suorong Zhang
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  2. Guoyan Chen
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  5. Ming Zhang
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All authors have been personally and actively involved in substantive work leading to the report.

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Correspondence to Suorong Zhang, Ming Zhang or Haojue Zhang.

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Zhang, S., Chen, G., Kong, L. et al. Research on the influence of limit wire guide on high thickness cutting of micro high-speed WEDM. Int J Adv Manuf Technol 125, 4065–4072 (2023). https://doi.org/10.1007/s00170-023-11032-w

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  • DOI: https://doi.org/10.1007/s00170-023-11032-w

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