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Inhibition of adhesive wear in tantalum cup deep drawing by ultrasonic vibration–assisted forming technology

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Abstract

Tantalum is widely used in capacitor field in modern times. The tantalum shell of capacitor is usually obtained by deep drawing process, and adhesive wear of the shell is the main hidden danger during its deep drawing process. In this paper, ultrasonic vibration–assisted deep drawing technology is proposed to manufacture tantalum capacitor shell, in order to effectively control the adhesive wear of tantalum capacitor with the assistance of ultrasonic vibration energy. Influence of ultrasonic vibration on deep drawing force and surface forming accuracy of tantalum cup deep drawing is discussed by applying different amplitudes of ultrasonic vibration signals at different time periods. The results reveal that in the amplitude range of 3–7 μm, the amplitude of 5 μm has the best inhibition effect on adhesive wear during the deep drawing of tantalum cup, and the effect is especially obvious in the initial stage of the deep drawing process; the reduction of wearing can reach more than 22% comparing with the results without ultrasonic amplitude.

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Funding

The work described in this paper was supported by the grants from the National Natural Science Foundation of China (Grant NO. 52005341) and National Taipei University of Technology-Shenzhen University Joint Research Program (Project NO. 2023010).

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All authors have contributed to the creation of this manuscript for important intellectual content and approved the final manuscript. Xu Teng: methodology; data curation; experiment; validation; formal analysis; writing, original draft, review, and editing. Dai Zhicong: supervision; writing, review, and provide method. Huang Jianbin, Dou Shihao: supervise and guide. Ran Jiaqi, Gong Feng: experiment and analyze the data, review, and editing.

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Correspondence to Jiaqi Ran or Feng Gong.

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Xu, T., Dai, Z., Huang, J. et al. Inhibition of adhesive wear in tantalum cup deep drawing by ultrasonic vibration–assisted forming technology. Int J Adv Manuf Technol 125, 4353–4361 (2023). https://doi.org/10.1007/s00170-023-11020-0

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