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Study on wear simulation of diamond abrasive tool for rotary ultrasonic grinding

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Abstract

The aim of this study is to explore the wear mechanism of diamond grinding tools in rotary ultrasonic grinding process and complete the simulation study of micro wear state of diamond grinding tools in different processing stages. Primarily, the morphology of single diamond abrasive grains is analyzed and studied, and a three-dimensional irregular abrasive grain simulation is carried out according to the morphology characteristics of diamond abrasive grains. Then, the center distance and spatial distribution law between diamond grits are obtained by calculation, and the discrete three-dimensional morphology simulation of diamond abrasive end face is completed based on the virtual lattice theory. Through the rotary ultrasonic grinding experiment, the wear form of diamond grits and the mathematical model of the wear amount of diamond grits changing with the removal amount of workpiece material are determined. The wear simulation of diamond abrasive tool with different workpiece removal is completed by using the mathematical model obtained from experiments. Last section, the number of abrasive particles in the simulation model and the wear amount of the abrasive tool are compared and analyzed with the corresponding experimental results. The above research provides a new research method for exploring the wear mechanism of diamond abrasive tools.

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Acknowledgement

The authors would like to thank Heilongjiang Provincial Natural Science Foundation funded project under No LH2019E061.

Funding

The work was supported by the Heilongjiang Provincial Natural Science Foundation, the authors state. (Project Number:LH2019E061).

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All authors contributed to the study conception and design. Material preparation, data collection, and analysis were performed by Shiliang Wei, Tao Zhang, Jiu Pi, Hengju Wei, Wenzhi Li, and Wei Wang. The first draft of the manuscript was written by Shiliang Wei and all authors commented on previous versions of the manuscript. All authors read and approved the final manuscript.

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Correspondence to Shiliang Wei.

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Wei, S., Zhang, T., Pi, J. et al. Study on wear simulation of diamond abrasive tool for rotary ultrasonic grinding. Int J Adv Manuf Technol 124, 3671–3686 (2023). https://doi.org/10.1007/s00170-023-10827-1

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  • DOI: https://doi.org/10.1007/s00170-023-10827-1

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