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Wear measurement of ultrathin grinding wheel using fiber optical sensor for high-precision wafer dicing

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Abstract

When the wafer dicing saw processes hard and brittle materials, the wear rate of the grinding wheel blade accelerates. To detect blade wear in time, a grinding wheel blade wear detection method based on a fiber optic sensor was proposed. This paper studied the principle of grinding wheel blade wear detection method, detection device, hardware system composition, and detection signal triggering process. To improve the accuracy of blade wear detection, the proportional–integral–derivative + feedforward + notch filter control algorithm was used to improve the dynamic and static response characteristics of the servo control system. This study aimed to analyze the influencing factors of the detection accuracy and efficiency of blade wear by the changing optical fiber power response mode, brightness setpoint, and signal capture detection speed. According to the experimental results, fine mode, 50% brightness setpoint, and signal capture detection speed of 0.4 mm/s were selected as the optimal parameters for blade wear detection. The performance verification experiment of the blade wear detection method was carried out under the optimized parameters. Results revealed that the maximum measurement error of the blade wear detection method was 3.8 μm. Because the measurement error could meet the industrial requirement that the measurement error of grinding wheel blade wear detection of wafer dicing saw was less than 5 μm, this method was feasible.

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Funding

This work was supported by the Key Research and Development Program of Hunan Provincial (No. 2021GK2025), the National Natural Science Foundation of China (No. 51975204), and the Natural Science Foundation of Hunan Province (No. 2021JJ30103).

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Authors and Affiliations

  1. College of Mechanical and Vehicle Engineering, Hunan University, Changsha, Hunan, 410082, China

    Fengjun Chen, Jianhang Huang, Jialiang Xu & Huidong Wang

  2. Hunan Accuracy Intelligent Technology Co. Ltd., Changsha, Hunan, 410205, China

    Tian Hu

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  1. Fengjun Chen
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Contributions

Fengjun Chen: guidance of article research and revision of manuscripts; Jianhang Huang: conception and writing of the manuscript; Jialiang Xu: assistance of the experiment and improvement of the manuscript; Huidong Wang: data analysis and image improvement; Tian Hu: technical support and research concept.

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Correspondence to Fengjun Chen.

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Chen, F., Huang, J., Xu, J. et al. Wear measurement of ultrathin grinding wheel using fiber optical sensor for high-precision wafer dicing. Int J Adv Manuf Technol 125, 2133–2145 (2023). https://doi.org/10.1007/s00170-023-10820-8

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