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Quantitative evaluation of the sheared edge of woven glass epoxy laminate after mechanical punching

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Abstract

Fiber-reinforced composites have a wide range of industrial applications owing to their light weight, high modulus, and good specific strength. Trimming using a mechanical punching tool is the fastest way to post process fiber-reinforced composites. However, quantitative analyses of the defects and process parameters are required to analyze the damage mechanisms and achieve high-quality cut surfaces. In this study, we quantitively investigated the defects on the sheared edge of woven glass epoxy laminates subjected to mechanical punching and explored the correlations between these defects and key process parameters, including punch-die clearance, weave alignment angle, and laminate thickness. The results demonstrate the necessity of considering glass fiber burr length and the dimensions of the cracked area simultaneously to evaluate the quality of the sheared surface. This study provides qualitative data on the interfacial damage mechanisms that occur during mechanical punching, which will help to tailor the process parameters of mechanical punching for fiber-reinforced polymers to obtain smooth cut surfaces.

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The datasets generated during the current study are available from the corresponding author on reasonable request.

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Funding

This study has been conducted with the support of the Korea Institute of Industrial Technology as “Development of intelligent root technology with add-on modules (kitech EO-22–0005).” The sponsors had no involvement in the study design; in the collection, analysis, or interpretation of data; in the writing of the report; or in the decision to submit the article for publication.

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Correspondence to Woo Chun Choi or Dong Earn Kim.

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Choi, H.S., Jeon, Y.J., Choi, W.C. et al. Quantitative evaluation of the sheared edge of woven glass epoxy laminate after mechanical punching. Int J Adv Manuf Technol 124, 2313–2321 (2023). https://doi.org/10.1007/s00170-022-10621-5

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  • DOI: https://doi.org/10.1007/s00170-022-10621-5

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