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Build plate conduction cooling for thermal management of wire arc additive manufactured components

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Abstract

Wire arc additive manufacturing (WAAM) allows for quick, large component manufacturing with fast deposition rates while leveraging readily available wire feedstock that is significantly cheaper than metal powder. However, the increased deposition rate of this process requires enhanced thermal management as failures can occur due to overheating. A common strategy to mitigate overheating is to dwell, or pause, between individual layers; however, this can significantly increase build times and eliminate the advantage of additive manufacturing being able to manufacture components quickly. To help mitigate this issue, this study explores the use of active cooling to maintain process control and to decrease overall build time. Conductive cooling applied to either the bottom or side of the print substrate was explored. Results from this study showed that bottom build plate active cooling can be used to decrease dwell times by up to 50% and decrease cool-down to room temperature after the building process by up to 75%. Results from this study demonstrate that the use of active cooling strategies for WAAM can be used for better thermal control over the process and should be further investigated.

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Acknowledgements

The authors would like to thank Christopher Masuo and Austen Thien for the help with setting up the retrofit machine for the depositions.

Funding

This work is funded by the Department of Energy DE-EE0008303 with the support of Oak Ridge National Laboratory. This manuscript has been authored by UT-Battelle, LLC under Contract No. DE-AC05-00OR22725 with the U.S. Department of Energy. Research was co-sponsored by the US Department of Energy, Office of Energy Efficiency and Renewable Energy, Advanced Manufacturing Office.

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Authors and Affiliations

  1. George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, 801 Ferst Dr, Atlanta, GA, 30332, USA

    Lauren Heinrich, Thomas Kurfess & Christopher Saldaña

  2. Oak Ridge National Laboratory, Manufacturing Science Division, 2350 Cherahala Blvd, Knoxville, TN, 37932, USA

    Lauren Heinrich, Thomas Feldhausen & Kyle Saleeby

Authors
  1. Lauren Heinrich
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  2. Thomas Feldhausen
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  3. Kyle Saleeby
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  4. Thomas Kurfess
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  5. Christopher Saldaña
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Contributions

All the authors contributed to this review study. Project scope was determined by Lauren Heinrich, Christopher Saldaña, Thomas Feldhausen, and Kyle Saleeby. Material preparation, data collection, and analysis were performed by Lauren Heinrich. The first draft of the manuscript was written by Lauren Heinrich and revised by Lauren Heinrich, Thomas Feldhausen, Kyle Saleeby, Thomas Kurfess, and Christopher Saldaña. Christopher Saldaña and Thomas Kurfess were responsible for the funding acquisition. All the authors read and approved the final manuscript.

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Correspondence to Lauren Heinrich.

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Heinrich, L., Feldhausen, T., Saleeby, K. et al. Build plate conduction cooling for thermal management of wire arc additive manufactured components. Int J Adv Manuf Technol 124, 1557–1567 (2023). https://doi.org/10.1007/s00170-022-10558-9

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  • DOI: https://doi.org/10.1007/s00170-022-10558-9

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