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Mechanism analysis and modeling of surface roughness for CeO2 slurry-enhanced grinding BK7 optics

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Abstract

Prolonged polishing deteriorates the shape accuracy of an optical element and reduces production efficiency simultaneously. In order to reduce the amount of polishing and polishing time, even obtain polish-free fine surfaces, a cerium oxide (CeO2) slurry-enhanced grinding (SEG) is investigated. However, the lack of in-depth mechanism explanation limits the optimization and application of SEG. In this research, a novel theoretical model was established to predict the surface roughness of the workpiece processed by CeO2 SEG. The modeling considered the effects of the protrusion height of active grains in the grinding wheel and the sizes and mass fractions of CeO2 particles in the grinding zone on undeformed chip thickness (UCT). Then, the mechanism of CeO2 SEG was investigated through the nanoindentation method. Indentation hardness and energy spectrum of the surface were estimated to verify the softened layer. The results showed that the model of surface roughness was well consistent with the experiment. CeO2 particle size significantly influenced the surface roughness than the mass fraction. The load-bearing effect of larger CeO2 particle size reduced the protruding height of the grinding wheel grains and reduced the UCT to a greater extent in the grinding process. The chemical reaction between CeO2 slurry and BK7 glass results in a softening layer which enhances the critical load and critical depth of the ductile–brittle transition of grinding. Finally, the optimized parameters were used for CeO2 SEG of ellipsoid BK7 optics and obtained the high surface quality.

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Abbreviations

A 1 :

The area of part I

A 2top:

The area of top of part II

A 3bottom:

The area of bottom of part III

α :

Geometrical factor of the indenter

α 0 :

Top angle of the indenter

a p :

Single grinding depth

a p, total :

Total grinding depth

c :

Lateral crack length

C d :

Active abrasive number in unit area

c m :

Median crack length

D :

Average height of CeO2 particles distributed along the protruding direction of abrasive

d :

Particle size of CeO2

δ :

Volume fraction of diamond abrasive in the grinding wheel

d g :

Equivalent spherical diameter of abrasive

d max :

Maximum height of CeO2 particles distributed along the protruding direction of abrasive

E (Ra)0.5 :

Predicted value of surface roughness when the particle size of CeO2 is 0.5 µm

E (Ra)1 :

Predicted value of surface roughness when the particle size of CeO2 is 1 µm

ϵ :

Active fraction of abrasive in the grinding process

H :

Microhardness in nanoindentation

K Id :

Dynamic fracture toughness

l c :

Chip length

M :

Mesh of grinding wheel

μ :

Mean value

N s :

Number of CeO2 particles in unit volume

ω :

Mass fraction of CeO2 slurry

P cd :

Dynamic impulse load

φ :

Volume fraction of CeO2 slurry

ρ :

Density of CeO2

SEG:

Slurry-enhanced grinding

σ :

Rayleigh parameter

τ :

Variance

θ :

Half of the included angle of abrasive

UCT:

Undeformed chip thickness

v :

Poisson ratio

v s :

Peripheral velocity of grinding wheel

v ω :

Feed speed

y cl :

Mean line of the assessment length

References

  1. Pei ZJ, Billingsley SR, Miura S (1999) Grinding induced subsurface cracks in silicon wafers. Int J Mach Tool Manu 39(7):1103–1116

    Google Scholar 

  2. Zhang B, Zheng XL, Tokura H, Yoshikawa M (2003) Grinding induced damage in ceramics. J Mater Process Tech 132(1):353–364

    CAS  Google Scholar 

  3. Bifano TG, Dow TA, Scattergood RO (1991) Ductile-regime grinding: a new technology for machining brittle materials. J Eng Ind 113(2):184–189

    Google Scholar 

  4. Brinksmeier E, Mutlugünes Y, Klocke F, Aurich JC, Shore P, Ohmori H (2010) Ultra-precision grinding CIRP Ann Manu Tech 59(2):652–671

    Google Scholar 

  5. Brinksmeier E, Riemer O, Kai R, Berger D (2016) Application potential of coarse-grained diamond grinding wheels for precision grinding of optical materials. Prod Eng 10:563–573

    Google Scholar 

  6. Solhtalab A, Adibi H, Esmaeilzare A, Rezaei SM (2019) Cup wheel grinding-induced subsurface damage in optical glass BK7: an experimental, theoretical and numerical investigation. Precis Eng 57:162–175

    Google Scholar 

  7. Michel MD, Serbena FC, Lepienski CM (2006) Effect of temperature on hardness and indentation cracking of fused silica. J Non-cryst Solids 352(32):3550–3555

    CAS  Google Scholar 

  8. Li Z, Zhang F, Luo X, Cheng W, Cai Y, Zhong W, Fei D (2018) Material removal mechanism of laser-enhanced grinding of RB-SiC ceramics and process optimization. J Eur Ceram Soc 39(4):705–717

    Google Scholar 

  9. Thonggoom R, Funkenbusch PD (2005) Transition in material removal behavior during repeated scratching of optical glasses. J Mater Sci 40(16):4279–4286

    CAS  Google Scholar 

  10. Li K, Liao TW (1996) Surface/subsurface damage and the fracture strength of ground ceramics. J Mater Process Tech 57(3–4):207–220

    CAS  Google Scholar 

  11. Yao P, Wang W, Huang CZ, Wang J, Zhu HT, Kuriyagawa T (2013) Indentation crack initiation and ductile to brittle transition behavior of fused silica. Adv Mater Res 797:667–672

    Google Scholar 

  12. Feng J, Wan Z, Wang W, Huang X, Ding X, Tang Y (2020) Unique crack behaviors of glass BK7 occurred in successive double scratch under critical load of median crack initiation. J Eur Ceram Soc 40(8):3279–3290

    CAS  Google Scholar 

  13. Feng J, Wan Z, Wang W, Huang X, Ding X, Jiang Z (2020) Scratch with double-tip tool: crack behavior during simultaneous double scratch on BK7 glass. J Eur Ceram Soc 40(12):4202–4216

    CAS  Google Scholar 

  14. Wang W, Yao P, Wang J, Huang CZ, Zhu HT, Liu HL, Zou B, Liu Y (2017) Controlled material removal mode and depth of micro cracks in precision grinding of fused silica – a theoretical model and experimental verification. Ceram Int 43(15):11596–11609

    CAS  Google Scholar 

  15. Pratap A, Patra K, Dyakonov AA (2019) Experimental analysis of ductile-brittle transitions for parallel and intersecting micro-slot grinding in BK-7 glass. Ceram Int 45(8):11013–11026

    CAS  Google Scholar 

  16. Pratap A, Patra K, Dyakonov AA (2019) On-machine texturing of PCD micro-tools for dry micro-slot grinding of BK7 glass. Precis Eng 55:491–502

    Google Scholar 

  17. Wang W, Yao P, Wang J, Huang CZ, Zhu HT, Zou B, Liu HL, Yan JW (2016) Crack-free ductile mode grinding of fused silica under controllable dry grinding conditions. Int J Mach Tool Manu 109:126–136

    Google Scholar 

  18. Zhao PY, Zhou M, Liu XL, Jiang B (2020) Effect to the surface composition in ultrasonic vibration-assisted grinding of BK7 optical glass. Appl Sci 10(2):516

    Google Scholar 

  19. Díaz-Tena E, Rodríguez A, Marcaide L, Bustinduy LG, Sáenz AE (2013) Use of extremophiles microorganisms for metal removal. Proced Eng 63:67–74

    Google Scholar 

  20. Díaz-Tena E, Rodríguez A, Marcaide L, Bustinduy LG, Sáenz AE (2014) A sustainable process for material removal on pure copper by use of extremophile bacteria. J Clean Prod 84:752–760

    Google Scholar 

  21. Díaz-Tena E, Gallastegui G, Hipperdinger M, Donati ER, Rodríguez A, Marcaide L, Elías A (2016) New advances in copper biomachining by iron-oxidizing bacteria. Corros Sci 112:385–392

    Google Scholar 

  22. Diaz-Tena E, Gallastegui G, Hipperdinger M, Donati E, Elias A (2018) Simultaneous culture and biomachining of copper in mac medium: a comparison between Acidithiobacillus ferrooxidans and Sulfobacillus thermosulfidooxidans. ACS Sustain Chem Eng 6(12):17026–17034

    CAS  Google Scholar 

  23. Zantye PB, Kumar A, Sikder AK (2004) Chemical mechanical planarization for microelectronics applications. Mater Sci Eng R: Reports 45(3–6):89–220

    Google Scholar 

  24. Yu J, He H, Jian Q, Zhang W, Zhang Y, Yuan W (2016) Tribochemical wear of phosphate laser glass against silica ball in water. Tribol Int 104:10–18

    CAS  Google Scholar 

  25. Ye J, Yu J, He H, Zhang Y (2017) Effect of water on wear of phosphate laser glass and BK7 glass. Wear 376–377:393–402

    Google Scholar 

  26. Guo X, Yuan S, Huang J, Chen C, Kang R, Jin Z, Guo D (2020) Effects of pressure and slurry on removal mechanism during the chemical mechanical polishing of quartz glass using ReaxFF MD. Appl Surf Sci 505:144610

    CAS  Google Scholar 

  27. Chandra A, Bastawros AF, Yu T, Asplund DT (2016) Chemical mechanical paired grinding: a tool for multi-wavelength planarization. Int J Adv Manuf Tech 1–4:1–7

    Google Scholar 

  28. Zhou L, Shimizu J, Eda H (2005) A novel fixed abrasive process: chemo-mechanical grinding technology. Int J Manu Tech Mana 7(5):441–454

    Google Scholar 

  29. Tian YB, Zhou L, Shimizu J, Tashiro Y, Kang RK (2009) Elimination of surface scratch/texture on the surface of single crystal Si substrate in chemo-mechanical grinding (CMG) process. Appl Surf Sci 255(7):4205–4211

    CAS  Google Scholar 

  30. Huang H, Wang BL, Wang Y, Zou J, Zhou L (2008) Characteristics of silicon substrates fabricated using nanogrinding and chemo-mechanical-grinding. Mater Sci Eng A 479(1–2):373–379

    Google Scholar 

  31. Dong ZG, Gao S, Huang H, Kang RK, Wang ZG (2016) Surface integrity and removal mechanism of chemical mechanical grinding of silicon wafers using a newly developed wheel. Int J Adv Manuf Tech 83:1231–1239

    Google Scholar 

  32. Zhang Z, Cui J, Wang B, Wang Z, Kang R, Guo D (2017) A novel approach of mechanical chemical grinding. J Alloy Compd 726:514–524

    CAS  Google Scholar 

  33. Zhang Z, Du Y, Wang B, Wang Z, Kang R, Guo D (2017) Nanoscale wear layers on silicon wafers induced by mechanical chemical grinding. Tribol Lett 65(4):1–13

    Google Scholar 

  34. Wu K, Zhou L, Onuki T, Shimizu J, Yamamoto T, Yuan J (2018) Study on the finishing capability and abrasives-sapphire interaction in dry chemo-mechanical-grinding (CMG) process. Precis Eng 52:451–457

    Google Scholar 

  35. Zhang Y, Li C, Jia D, Zhang D, Zhang X (2015) Experimental evaluation of MoS2 nanoparticles in jet MQL grinding with different types of vegetable oil as base oil. J Clean Prod 87:930–940

    CAS  Google Scholar 

  36. Sui M, Li C, Wu W, Yang M, Cao H (2021) Temperature of grinding carbide with castor oil-based MoS2 nanofluid minimum quantity lubrication. J Therm Sci Eng Appl 13(5):1–30

    Google Scholar 

  37. Wang YG, Li CH, Zhang YB, Li BK, Yang M (2016) Experimental evaluation of the lubrication properties of the wheel/workpiece interface in MQL grinding with different nanofluids. Tribol Int 99:198–210

    CAS  Google Scholar 

  38. Zhang XP, Li CH, Zhang YB, Jia DZ, Li BK, Wang YG, Yang M, Hou YL, Zhang XW (2016) Performances of Al2O3/SiC hybrid nanofluids in minimum-quantity lubrication grinding. Int J Adv Manuf Technol 86:3427–3441

    Google Scholar 

  39. Gao T, Zhang XP, Li CH, Zhang YB, Yang M, Jia DZ, Ji HJ, Zhao YJ, Li RZ, Yao P, Zhu LD (2020) Surface morphology evaluation of multi-angle 2D ultrasonic vibration integrated with nanofluid minimum quantity lubrication grinding. J Manuf Process 51:44–61

    Google Scholar 

  40. Zhang J, Wu W, Li C, Yang M, Ali HM (2020) Convective heat transfer coefficient model under nanofluid minimum quantity lubrication coupled with cryogenic air grinding Ti–6Al–4V. Int J Pr Eng Man-GT 7–8:1–23

    Google Scholar 

  41. Zhang Y, Li C, Jia D, Zhang D, Zhang X (2015) Experimental evaluation of the lubrication performance of MoS2/CNT nanofluid for minimal quantity lubrication in Ni-based alloy grinding. Int J Mach Tool Manu 99:19–33

    Google Scholar 

  42. Gao T, Li C, Jia D, Zhang Y, Yang M, Wang X, Cao H, Li Y, Ali HM, Xu X (2020) Surface morphology assessment of CFRP transverse grinding using CNT nanofluid minimum quantity lubrication. J Clean Prod 277:123328

    CAS  Google Scholar 

  43. Qu S, Yao P, Gong YD, Chu DK, Yang YY, Li CW, Wang ZL, Zhang XP, Hou Y (2022) Environmentally friendly grinding of C/SiCs using carbon nanofluid minimum quantity lubrication technology. J Clean Prod 366(15):132898

    CAS  Google Scholar 

  44. Liu M, Li C, Zhang Y, An Q, Yang M, Gao T, Mao C, Liu B, Cao H, Xu X, Said Z (2021) Cryogenic minimum quantity lubrication machining: from mechanism to application. Front Mech Eng-Prc 16(4):649–697

    Google Scholar 

  45. Yang M, Li C, Luo L, Li Y, Long Y (2021) Predictive model of convective heat transfer coefficient in bone micro-grinding using nanofluid aerosol cooling. Int Commun Heat Mass 125:105317

    CAS  Google Scholar 

  46. Gao T, Li C, Yang M, Zhang Y, Jia D, Ding W, Debnath S, Yu T, Said Z, Wang J (2021) Mechanics analysis and predictive force models for the single-diamond grain grinding of carbon fiber reinforced polymers using CNT nano-lubricant. J Mater Process Tech 290(9–12):116976

    CAS  Google Scholar 

  47. Zhang YB, Li HN, LI CH, Huang CZ, Ali HM, Xu XF, Mao C, Ding WF, Cui X, Yang M, Yu TB, Jamil M, Gupta MK, Jia DZ, Said Z (2022) Nano-enhanced biolubricant in sustainable manufacturing: from processability to mechanisms. Friction 10(6):1–39

    Google Scholar 

  48. Peng WQ, Guan CL, Li SY (2014) Material removal mechanism of ceria particles with different sizes in glass polishing. Optic Eng 53(3):035104

    Google Scholar 

  49. Deng H, Hosoya K, Imanishi Y, Endo K, Yamamura K (2015) Electro-chemical mechanical polishing of single-crystal sic using CeO2 slurry. Electr Comm 52:5–8

    CAS  Google Scholar 

  50. Yu J, Yuan W, Hu H, Zang H, Cai Y, Ji F (2015) Nanoscale friction and wear of phosphate laser glass and BK7 glass against single CeO2 particle by AFM. J Am Ceram Soc 98(4):1111–1120

    CAS  Google Scholar 

  51. Kang R, Gao S, Jin Z, Guo D (2009) Study on grinding performance of soft abrasive wheel for silicon wafer. Key Eng Mater 416:529–534

    CAS  Google Scholar 

  52. Chen Z, Zhan S, Zhao Y (2021) Electrochemical jet-assisted precision grinding of single-crystal sic using soft abrasive wheel. Int J Mech Sci 195:106239

    Google Scholar 

  53. Wu K, Touse D, Zhou L, Lin W, Yuan J (2021) Chemo-mechanical grinding by applying grain boundary cohesion fixed abrasive for monocrystal sapphire. Precis Eng 70:110–116

    Google Scholar 

  54. Kakinuma Y, Konuma Y, Fukuta M, Tanaka K (2019) Ultra-precision grinding of optical glass lenses with La-doped CeO2 slurry. CIRP Ann Manu Tech 68(1):345–348

    Google Scholar 

  55. Zhang L, Liu GY, Zhu LM, Zhou TF, Guo P, Liu P (2021) Experimental study on near-polished ultra-precision grinding of fused glass with the assistant of pure CeO2 atomizing liquid. Int J Adv Manuf Tech 115:3243–3249

    Google Scholar 

  56. Zhang Z, Yao P, Li X, Wang J, Liu H (2020) Grinding performance and tribological behavior in solid lubricant assisted grinding of glass-ceramics. J Manuf Process 51:31–43

    Google Scholar 

  57. Chen X, Rowe WB (1996) Analysis and simulation of the grinding process. Part II: mechanics of grinding. Int J Mach Tool Manu 36:883–896

    Google Scholar 

  58. Antwi EK, Liu K, Hao W (2018) A review on ductile mode cutting of brittle materials. Front Mech Eng-Prc 13(2):13

    Google Scholar 

  59. Chen X, Rowe WB (1996) Analysis and simulation of the grinding process Part I: generation of the grinding wheel surface. Int J Mach Tool Manu 36(8):871–882

    Google Scholar 

  60. Ali Z, Bahman A (2017) An analytical force and surface roughness model for cylindrical grinding of brittle materials. Int J Abra Tech 8(1):68–81

    Google Scholar 

  61. Qu S, Yao P, Gong Y, Yang Y, Chu D, Zhu Q (2022) Modelling and grinding characteristics of unidirectional C-SiCs. Ceram Int 48(6):8314–8324

    CAS  Google Scholar 

  62. Younis MA, Alawi H (1984) Probabilistic analysis of the surface grinding process. T Can Soc Mech Eng 8(4):208–213

    Google Scholar 

  63. Xu HHK, Jahanmir S, Ives LK (1997) Effect of grinding on strength of tetragonal zirconia and zirconia toughened alumina. Mach Sci Tech 1(1):49–66

    CAS  Google Scholar 

  64. Malkin S (1991) Grinding technology: theory and applications of machining with abrasives. Int J Mach Tool Manu 31(3):435–436

    Google Scholar 

  65. Sun L, Yang SM, Yang L, Zhao P, Wu PF, Jiang ZD (2015) A new model of grinding forces prediction for machining brittle and hard materials. Proce CIRP 27:192–197

    CAS  Google Scholar 

  66. Yao W, Chu Q, Lyu B, Wang C, Shao Q, Feng M, Wu Z (2022) Modeling of material removal based on multi-scale contact in cylindrical polishing. Int J Mech Sci 223(1):107287

    Google Scholar 

  67. Zheng F, Kang RK, Dong Z, Guo J, Liu J, Zhang J (2018) A theoretical and experimental investigation on ultrasonic assisted grinding from the single-grain aspect. Int J Mech Sci 148:667–675

    Google Scholar 

  68. Jing X, Maiti S, Subhash G (2007) A new analytical model for estimation of scratch-induced damage in brittle solids. J Am Ceram Soc 90:885–892

    CAS  Google Scholar 

  69. Gu W, Yao Z, Li K (2011) Evaluation of subsurface crack depth during scratch test for optical glass BK7. PI Mech Eng CJ Mec Eng Sci 225:2767–2774

    Google Scholar 

  70. Arif M, Rahman M, San WY (2011) Analytical model to determine the critical feed per edge for ductile–brittle transition in milling process of brittle materials. Int J Mach Tool Manuf 51:170–181

    Google Scholar 

  71. Zhang ZZ, Yao P, Wang J, Huang CZ, Zhu HT, Liu HL, Zou B (2020) Nanomechanical characterization of RB-SiC ceramics based on nanoindentation and modelling of the ground surface roughness. Ceram Int 46(5):6243–6253

    CAS  Google Scholar 

  72. Zhang ZZ, Yao P, Wang J, Huang CZ, Cai R, Zhu HT (2019) Analytical modeling of surface roughness in precision grinding of particle reinforced metal matrix composites considering nanomechanical response of material. Int J Mech Sci 157:243–253

    Google Scholar 

  73. Kim HM, Venkatesh RP, Kwon TY, Park JG (2012) Influence of anionic polyelectrolyte addition on ceria dispersion behavior for quartz chemical mechanical polishing. Colloid Surface A 411(411):122–128

    CAS  Google Scholar 

  74. Zhang XP, Li CH, Zhang YB, Wang YG, Li BK, Yang M, Guo SM, Liu GT, Zhang NQ (2017) Lubricating property of MQL grinding of Al2O3/SiC mixed nanofluid with different particle sizes and microtopography analysis by cross-correlation. Precis Eng 47:532–545

    Google Scholar 

  75. Chen M, Zhao Q, Dong S, Li D (2005) The critical conditions of brittle–ductile transition and the factors influencing the surface quality of brittle materials in ultra-precision grinding. J Mater Process Tech 168:75–82

    CAS  Google Scholar 

  76. Suzuki K, Kato M, Sunaoshi T, Uno H, Carvajal-Nunz U, Mcclellan NAT, KJ, (2019) Thermal and mechanical properties of CeO2. J Am Ceram Soc 102(4):1994–2008

    CAS  Google Scholar 

  77. Yao W, Lyu B, Wang C, Fei X, Zhang L (2021) Modeling, simulation, and experimental verification on material removal and rounding process of centerless cylindrical finishing with free abrasives and soft pad. Int J Adv Manuf Tech 114:1443–1455

    Google Scholar 

  78. Kalthoff JF (1988) Shadow optical analysis of dynamic shear fracture. SPIE Photo Spe Metro 27(10):835–840

    Google Scholar 

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Funding

This work was supported by the National Key R&D Program of China (No. 2021YFB3203100) and the National Natural Science Foundation of China (Nos. 51875321 and 52075302).

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Authors and Affiliations

  1. Center for Advanced Jet Engineering Technologies (CaJET), School of Mechanical Engineering, Shandong University, Jinan, 250061, Shandong, China

    Xianpeng Zhang, Peng Yao, Hongtao Zhu & Hanlian Liu

  2. Key Laboratory of High Efficiency and Clean Mechanical Manufacture of the Ministry of Education, Jinan, 250061, China

    Xianpeng Zhang, Peng Yao, Hongtao Zhu & Hanlian Liu

  3. Beijing Institute of Control Engineering, Beijing, 100190, China

    Yueming Li, Jimiao Xu & Shitong Liang

  4. GoerTek Inc, Weifang, 250061, China

    Long Jiang & Xiyong Jin

  5. Shanghai Institute of Aerospace System Engineering, Shanghai, 200000, China

    Jiahao Zhu

  6. School of Mechanical Engineering, Yanshan University, Qinhuangdao, 066004, Hebei, China

    Chuanzhen Huang

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  1. Xianpeng Zhang
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  2. Peng Yao
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Contributions

Xianpeng Zhang: conceptualization, methodology, validation, formal analysis, investigation, and writing of original draft. Peng Yao: resources, writing including review and editing, funding acquisition, and data curation. Yueming Li: resources and writing including review and editing. Long Jiang: formal analysis and visualization. Xiyong Jin: formal analysis and data sorting. Jimiao Xu: supervision and data curation. Shitong Ling: software and validation. Jiahao Zhu: experiment, data sorting, and validation. Chuanzhen Huang: supervision and project administration. Hongtao Zhu: formal analysis and writing including review & editing. Hanlian Liu: software and data curation.

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Correspondence to Peng Yao or Yueming Li.

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Zhang, X., Yao, P., Li, Y. et al. Mechanism analysis and modeling of surface roughness for CeO2 slurry-enhanced grinding BK7 optics. Int J Adv Manuf Technol 131, 2017–2038 (2024). https://doi.org/10.1007/s00170-022-10554-z

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