Abstract
Surface quality analysis of polished surface has been the subject of many classic studies in surface polishing technology and is a key indicator for evaluating the polishing path. However, as an important part of surface quality, surface texture features have been ignored in many related researches. In this paper, a new method to analyze the texture features of polishing based on co-occurrence matrix is proposed. It provides a new perspective of surface quality analysis focusing on surface texture features. It extends the previous approach termed the residual level co-occurrence matrix (RLCM) focusing on the distribution of surface polishing residues, leading to more targeted and stabilized evaluation results. This method can be used in the path planning stage to estimate the polishing quality of the planned path without physical processing, which can avoid resource waste in the physical world. Furthermore, in this method, the usage of images is avoided, which can ensure that the results are not affected by the light and image quality. Simulation experiments as well as empirical investigations were conducted to verify the feasibility of the method. The results of both consistently reveal that the proposed method is able to accurately describe the texture feature and correctly analyze the texture feature.
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Funding
This study was supported in part by grants from the National Defense Basic Scientific Research Program of China (grant no. JCKY2020210C002) and the National Natural Science Foundation of China—Liaoning Provincial Joint Fund (grant no. U1908230).
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JiaXuan Li performed the algorithm design and code writing and was a major contributor in writing the manuscript. The above work was completed under the guidance of Bo Zhou and Lun Li. Guang Zhu and Cai Ming analyzed and interpreted the experimental data. All authors read and approved the final manuscript.
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Li, J.X., Zhou, B., Li, L. et al. A method for analyzing the texture features of free-form surface polishing paths based on co-occurrence matrix. Int J Adv Manuf Technol 124, 601–618 (2023). https://doi.org/10.1007/s00170-022-10401-1
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DOI: https://doi.org/10.1007/s00170-022-10401-1