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Digital microassembly method for trans-scale microparts based on digital microassembly space

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Abstract

Because of small depth of field and small field of view of microscopic vision system in microassembly system, global morphologies, local features, and spatial states of trans-scale microparts and microgripper jaws in microassembly space cannot be observed and described simultaneously, which limits high-precision microassembly of trans-scale microparts. In this paper, a topological configuration of digital microassembly for microassembling microparts based on digital microassembly space as basic architecture of realizing different principles of digital microassembly is proposed. Accordingly, a principle of digital microassembly for realizing digital microassembly of hohlraum versus cone cavity is established based on digitalization principle of microassembly space and estimation method of microassembly position and orientation based on virtual digital microassembled target. The research results show that the topological configuration of digital microassembly of microparts based on digital microassembly space is the basic architecture of realizing different principles of digital microassembly. The constructed principle of digital microassembly can be used to realize the digital microassembly of hohlraum versus cone cavity with high accuracy. The estimation method of microassembly position and orientation based on virtual digital microassembled target can obtain microassembly position and orientation of hohlraum and cone cavity. And the digital pre-microassembly of hohlraum versus cone cavity can be used to analyze the assemblability of digital microassembly of hohlraum versus cone cavity. Therefore, digital microassembly of microparts based on digital microassembly space provides a novel method for realizing high-precision microassembly of microparts and lays a foundation for prospering microassembly technologies of microparts.

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Funding

This work is supported by the National Natural Science Foundation of China (Grant No. 51675070, U21B2074), the Fundamental Research Funds for the Central Universities (Project No. 2018CDYJSY0055), and the LPMT, CAEP (Grant No. 2015–01-001).

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Authors and Affiliations

  1. Key Laboratory of Optoelectronic Technology and Systems of the Ministry of Education of China, Chongqing University, Chongqing, 400044, China

    Dai-Hua Wang

  2. Precision and Intelligence Laboratory, Department of Measurement and Control Technology and Instruments, Chongqing University, Chongqing, 400044, China

    Kan Wang, Li-Ping Bao & Dai-Hua Wang

Authors
  1. Kan Wang
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  2. Li-Ping Bao
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  3. Dai-Hua Wang
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Contributions

Kan Wang conceived research, completed the relevant experiments, analyzed the data, and wrote the manuscript; Li-Ping Bao participated in the revising of the manuscript; Dai-Hua Wang conceived research and participated in the writing and revising of the manuscript.

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Correspondence to Dai-Hua Wang.

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Wang, K., Bao, LP. & Wang, DH. Digital microassembly method for trans-scale microparts based on digital microassembly space. Int J Adv Manuf Technol 122, 2719–2744 (2022). https://doi.org/10.1007/s00170-022-09981-9

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  • DOI: https://doi.org/10.1007/s00170-022-09981-9

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