Abstract
The quality and life of the injected product are affected by surface quality of curved mold, and reasonable polishing method is the key to obtain the high-quality surface of curved mold. Small polishing tool is controlled by constant displacement polishing in the conventional method of robot polishing. The polishing force is adjusted to affect the surface quality of mold during mold polishing. The shortcomings of traditional control method of robot are investigated by simulation, and the constant force control approach is proposed to maintain stable force, which is achieved by a position-based impedance control algorithm. The polishing experiments of curved mold are conducted by using two control methods with constant displacement control polishing (CDCP) and constant force control polishing (CFCP), respectively. The experimental results show that the CFCP method can maintain polishing force stability and the reduction of surface roughness in the three groups of experiments using CDCP method is much lower than that of CFCP method, respectively. The feasibility of constant force control polishing method (CFCP) is verified.
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Acknowledgements
The authors would like to thank Beijing Key Laboratory of Advanced Manufacturing Technology, Laboratory of Robotics and Intelligent Systems (CAS Quanzhou) for the experimental support. The authors would also like to acknowledge the editors and the anonymous referees for their insightful comments.
Funding
This work was financially supported by the Nation Natural Science Foundation of China (Grant No. 517750010) and Scientific and Technological Project of Quanzhou (No. 2020C071).
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Guangsheng Chang: methodology, simulation analysis, and writing—original draft. Yinhui Xie and Jinxing Yang: date curation and validation. Yong Yang: experiment operation. Ri Pan and Jun Li: writing—review and editing and resources.
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Chang, G., Pan, R., Xie, Y. et al. Research on constant force polishing method of curved mold based on position adaptive impedance control. Int J Adv Manuf Technol 122, 697–709 (2022). https://doi.org/10.1007/s00170-022-09943-1
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DOI: https://doi.org/10.1007/s00170-022-09943-1