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A novel polishing process with rigid-flexible composite structure plate for sapphire wafer polishing

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Abstract

A novel flexible polishing process has been developed for sapphire wafer by using a polishing plate with a rigid-flexible composite structure to satisfy the demands of excellent surface shape accuracy and high surface topography quality simultaneously. This new polishing plate was fabricated by alternately casting and curing the ring structure of soft and hard unsaturated resins. It is found that the overall stiffness of the polishing plate is improved due to the “hard support frame” of the rigid-flexible polishing plate, as well as the ability of removal selectivity of the polishing plate is strengthened. The topography quality and shape accuracy of sapphire wafer polished by the presented novel polishing process have been compared with those polished by conventional flexible polishing, respectively. Both experiment and simulation results are shown that the surface roughness and topographical variations of sapphire wafer polished by the novel rigid-flexible composite structure polishing plate have been greatly improved. Compared with the conventional flexible polishing, the surface shape accuracy of the sapphire wafer polished by the presented novel polishing process can be improved by 54.1%.

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Funding

The authors appreciate the financial support from Program for Innovative Research Team in Science and Technologe in Fujian Province University (IRTSTFJ), National Natural Science Foundation of China (Grant No. 51775113), Educational and Scientific Research Program for Young and Middle-aged Teachers of the Education Department of Fujian Province (Grant No. JAT190402), and Fujian University of Technology scientific research fund (Grant No. GY-Z19124).

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Authors and Affiliations

  1. School of Materials Science and Engineering, Fujian University of Technology, Fuzhou, 350118, China

    Yongchao Xu, Chen Lin & Qianting Wang

  2. School of Mechanical and Automotive Engineering, Fujian University of Technology, Fuzhou, 350118, China

    Charlesming Zheng, Youji Zhan & Bingsan Chen

Authors
  1. Yongchao Xu
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  2. Chen Lin
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  3. Qianting Wang
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  4. Charlesming Zheng
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  5. Youji Zhan
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  6. Bingsan Chen
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Contributions

All authors contributed to the study’s conception and design. Yongchao Xu and Chen Lin contributed significantly to the compilation of experimental results and wrote the first draft of the manuscript. Qianting Wang and Charlesming Zheng helped analyze and revise the manuscript. Youji Zhan and Bingsan Chen contributed to the final proofreading of the review manuscript.

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Correspondence to Qianting Wang.

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Xu, Y., Lin, C., Wang, Q. et al. A novel polishing process with rigid-flexible composite structure plate for sapphire wafer polishing. Int J Adv Manuf Technol 122, 659–668 (2022). https://doi.org/10.1007/s00170-022-09733-9

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  • DOI: https://doi.org/10.1007/s00170-022-09733-9

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