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Numerical analysis performance of microbump cutting tool in hot machining Ti-6Al-4V

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Abstract

In this paper, a micro-bump tool is designed to prepare micro-bumps on the rake face of different tools for cutting titanium alloys. The study found that the micro-bump tool can effectively reduce the tool surface temperature (up to 26.83%) and reduce tool wear (up to 25.2%) due to the presence of bumps that change the contact state between the chip and the tool surface. The only downside is that the cutting force during cutting is higher than with ordinary tools. Aiming at this downside, this paper studies the cutting states (20–600 °C) of three conventional tools and corresponding micro-bump tools at different heat-assisted temperatures by using heat-assisted machining technology. The study found that the application of heat-assisted machining technology can effectively reduce the cutting force of the micro-bump tool, while retaining the advantages of the micro-bump tool, which can reduce temperature and reduce wear at different hot working temperatures.

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Data availability

The material and data in this paper are obtained by software simulation and quoting other people’s experimental data.

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Acknowledgements

We thank Dr. Fujiang Yang for his suggestions in the writing of the paper, thank Yue Su for her help in data compilation, and thank Yufeng Chen for her enlightenment on the paper. It is a blessing to have you in life. Thank fate for letting us meet.

Funding

This work is supported by the National Natural Science Foundation of China (No. 51775328).

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Contributions

Xu Zhang analyzed and verified the usability and accuracy of the model. Xin Liu modeled the tool and analyzed the performance comparison of different texture tools and the effect of texture on the tool. All authors read and approved the final manuscript.

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Correspondence to Xin Liu.

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Liu, X., Zhang, X. Numerical analysis performance of microbump cutting tool in hot machining Ti-6Al-4V. Int J Adv Manuf Technol 121, 2005–2021 (2022). https://doi.org/10.1007/s00170-022-09477-6

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  • DOI: https://doi.org/10.1007/s00170-022-09477-6

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