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Roll bonding mechanism for Mg/Al composite plate based on electron work function in the initial stage

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Abstract

Mg/Al laminate composites were prepared at 400 ℃ for 15 min through single-pass rolling with reduction ratio from 10 to 27%. The bonding mechanism of the initial bonding stage under low pressure was studied. Two critical statuses (beginning bonding and complete bonding) are found at the reduction ratio of 14.5% and 21.75%. In this article, the coincidence of the ratio of external force (normal stress) and internal force (electronic force) at the two critical points shows that electrons overcome the potential barriers of Mg and Al respectively and make them move freely to form metal bonds. The free movement of electrons between two metal interfaces forms a metallic bond, which bonds the two metals. The formation of metallic bonds overcomes the classical barrier to achieve electron free motion. The ratio of σMg to σAl (σMg/σAl) is 0.7340, and the ratio of fMg to fAl (fMg/fAl) is 0.7988, where it can be found that the former agrees well with the latter. The good agreement between theory and experiment proves that overcoming the potential barrier plays an important role in the early bonding stage of bimetal composite plates.

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The data that support the findings of this study are available upon reasonable request from the authors.

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Funding

This work was supported by the Innovation Project of Graduate Education in Shanxi Province (2020BY110), the National Natural Science Foundation of China (No. 51871158), the STIP of Shanxi (No. 2020L0349), the National Key Research and Development Program (2018YFA0707300), and the General Program of National Natural Science Foundation of China (grant number 51905372).

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Authors and Affiliations

  1. Heavy Machinery Engineering Research Center of the Ministry of Education, Taiyuan University of Science and Technology, Taiyuan, 030024, People’s Republic of China

    Haoyue Jia

  2. School of Mechanical Engineering, Taiyuan University of Science and Technology, Taiyuan, 030024, People’s Republic of China

    Haoyue Jia

  3. College of Mechanical and Vehicle Engineering, Taiyuan University of Technology, Taiyuan, 030024, People’s Republic of China

    Jianchao Han & Tao Wang

  4. School of Applied Science, Taiyuan University of Science and Technology, Taiyuan, 030024, People’s Republic of China

    Kun Li & Yunzhong Lai

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  1. Haoyue Jia
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  2. Jianchao Han
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  4. Yunzhong Lai
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  5. Tao Wang
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Contributions

Haoyue Jia: conceptualization, methodology, software, data curation, writing–original draft. Jianchao Han: supervision, project administration. Kun Li: investigation, visualization. Yunzhong Lai: methodology, conceptualization, writing—review and editing. Tao Wang: validation, writing–review and editing.

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Correspondence to Yunzhong Lai or Tao Wang.

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Jia, H., Han, J., Li, K. et al. Roll bonding mechanism for Mg/Al composite plate based on electron work function in the initial stage. Int J Adv Manuf Technol 121, 4517–4531 (2022). https://doi.org/10.1007/s00170-022-09419-2

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