Abstract
The wire bow angle is an important factor that affects the shape precision of an ingot after the diamond wire sawing process. In this research, the wire bow angles of the inside and outside of an ingot were recorded with a high-speed camera. The effects of the processing parameters such as the wire tension force, feed speed, and wire velocity on the wire bow angles inside and outside the ingot were analyzed. A numerical simulation model of the wire bow in the wire sawing process is presented in this paper to describe the wire bow angle inside the ingot. It was shown that the wire bow angle inside the ingot was smaller than that of outside the ingot for all of the processing parameters. The wire bow angles improved with the increase of the feed speed and decrease of the wire velocity and the wire tension force. The results of the wire bow angle measurement of the inside ingot and the simulation calculation were similar for the process parameters.
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Acknowledgements
Zhiteng Xu and Hui Huang would like to acknowledge the financial supports from the National Natural Science Foundation of China (51375179, U1805251), from the Changjiang Scholars and Innovative Research Team in University (IRT_17R41), and from the Major Science and Technology Project of Xiamen City (3502ZCQ20191007).
Funding
This work was supported by the National Natural Science Foundation of China (51375179, U1805251), the Changjiang Scholars and Innovative Research Team in University (IRT_17R41), and the Major Science and Technology Project of Xiamen City (3502ZCQ20191007).
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All authors contributed to the study conception and design. ZX is the executor of article writing and experiment operation. HH contributed to the conception of the work. CC reviewed and edited the paper. All authors read and approved the final manuscript.
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Xu, Z., Huang, H. & Cui, C. Measurement and simulation calculation of wire bow angle during the diamond wire saw process. Int J Adv Manuf Technol 120, 7197–7204 (2022). https://doi.org/10.1007/s00170-022-09233-w
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DOI: https://doi.org/10.1007/s00170-022-09233-w