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Research on the grinding performance of a defined grain arrangement diamond grinding wheel with small grit (95 μm)

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Abstract

A grain-arranged grinding wheel refers to a grinding wheel where the position of abrasive particles on the wheel can be customized. In this paper, the processing quality of the grain-arranged grinding wheel in different grain arrangements, including rectangle, rhomboid, and oblique rectangle arrangement, respectively, is compared with that of conventional grinding wheel in the grinding of single-crystal silicon. Comparisons have also been made between arranged wheel in oblique rectangle arrangement and conventional wheel in terms of 2D- and 3D-machined surface morphology, surface roughness, and grinding force. By considering the effects of the material removal process, abrasive grain interactions, and grain arrangement parameters, a grinding force model is built for the grain-arranged grinding wheel. Through processing experiments with different grinding wheels, it is found that the grain arrangement has a great influence on the machined surface quality. Rational and orderly grain arrangement can improve the machined surface quality and machining stability, but the machined surface quality of a grain-arranged wheel is not always better than that of a conventional wheel. Specifically, the machined surface quality of arranged wheels in rectangle arrangement is always the worst, but the difference of machined surface quality of the other three kinds of grinding wheels is not significant at low feeding velocity. With the increase of feeding velocity, the machined surface quality of arranged wheel in oblique rectangle and rhomboid grain arrangement will gradually be better than that of the conventional wheel. In respect of grinding force, it is found that arranged wheel in oblique rectangle arrangement owns a smaller average force and a more stable momentary force than that of the conventional grinding wheel. For the grinding force model built in this paper, its effectiveness and accuracy were finally verified by experiments.

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Availability of data and materials

All data generated or analyzed during this study are included in this submitted article.

Abbreviations

W :

Width of the grinding wheel

R tool :

Radius of the grinding wheel

a, b :

Distance between adjacent rows and adjacent columns of the defined grain arrangement, respectively

λ :

Angle formed by the row of grain arrangement and the horizontal line

ξ :

Angle formed by the column of grain arrangement and the vertical line

△x :

Horizontal distance between adjacent two grains within columns

△z :

Vertical distances between adjacent two grains within rows

s :

Distance abrasive grain moves in a single time interval

s arr :

The maximum vertical distance between traces of grains 1 and 4

v w, v s :

Linear speed of workpiece and grinding wheel, respectively

L :

Distance between adjacent two grains

a p :

Radial cutting depth

a z :

Axial cutting depth

n :

Rotation speed of grinding wheel

h m :

Maximum grain undeformed chip thickness

d g :

Abrasive grain size diameter

α :

The maximum grain contact angle in the grinding contact zone

ω :

Angular speed of the grinding wheel

p 0 :

The maximum grain penetration depth

h 0,c :

Critical cutting depth

F t, F n :

Tangential and normal grinding forces, respectively

F t g, F ng :

Tangential and normal grinding forces of single grain, respectively

F cg,t, F c g,n :

Grain cutting force in tangential and normal directions, respectively

F pg,t, F p g,n :

Grain plowing force in tangential and normal directions, respectively

F x, ave,arr, F y ,ave,arr :

Average grinding force of the grain-arranged grinding wheel oblique grain arrangement in x and y directions, respectively

F x ,ave,con, F y ,ave,con :

Average grinding force of conventional grinding wheel in x and y directions, respectively

F x ,t,arr :

Momentary grinding force in the x direction of the grains arranged grinding tool in oblique grain arrangement

F x ,t,con :

Projection area of the cutting chip of single grain

τ s :

Shear strength of the workpiece

φ i :

Instantaneous shear angle of abrasive grain

β i :

Instantaneous friction angle of abrasive grain

θ i :

Instantaneous rake angle of abrasive grain

θ c :

Critical rake angle of abrasive grain

f s :

Sampling frequency of the dynamometer

N t :

Total number of abrasive grains in the contact zone

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Funding

The authors would like to thank the support of the National Natural Science Foundation of China (No. 51575096) and the China Fundamental Research Funds for the Central Universities (No. N180304014).

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Authors and Affiliations

  1. Advanced Manufacturing Institute, Northeastern University, P.O. Box 319, Shenyang, People’s Republic of China, 110004

    Jun Wu, Jun Cheng, Baoyu Liu, Tao Yu & Chunchun Gao

Authors
  1. Jun Wu
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  2. Jun Cheng
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  3. Baoyu Liu
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  4. Tao Yu
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  5. Chunchun Gao
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Contributions

Jun Cheng contributed to the conception of the study; Jun Wu performed the data analyses and wrote the manuscript; Baoyu Liu performed the experiment; Tao Yu and Chunchun Gao helped perform the analysis with constructive discussions.

Corresponding author

Correspondence to Jun Cheng.

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Wu, J., Cheng, J., Liu, B. et al. Research on the grinding performance of a defined grain arrangement diamond grinding wheel with small grit (95 μm). Int J Adv Manuf Technol 120, 4403–4422 (2022). https://doi.org/10.1007/s00170-022-09030-5

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  • DOI: https://doi.org/10.1007/s00170-022-09030-5

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